Coupling between Vias and the PCB Power-Bus

Abstract

Abstract. In this paper, a method for the extraction of data for a through-hole vertical interconnect access (via) on a printed circuit board (PCB) is presented. It uses a matrix de-embedding algorithm and two-port theory to extract the elements of an assumed lumped via model. After that the influence of the via on the power-bus impedance and the coupling between the via and the power-bus are described using this model.