2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2020
DOI: 10.1109/ipfa49335.2020.9261020
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Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels

Hua Xu1,
Jeffery C. C. Lo
2
,
S. W. Ricky Lee3
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