Data Center Energy Reduction by Lowering Chip-to-Supply Thermal Resistance

Bock, P.; Bress, Thomas J.; Lecoustre, Vivien; Gidwani, Ashok; Noyes, Connor

doi:10.1109/itherm55368.2023.10177591

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2023

DOI: 10.1109/itherm55368.2023.10177591

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Data Center Energy Reduction by Lowering Chip-to-Supply Thermal Resistance

P. Bock

Thomas J. Bress

Vivien Lecoustre

et al.

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Data Center Energy Reduction by Lowering Chip-to-Supply Thermal Resistance

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References 18 publications

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