DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

Abstract

Non-isothermal dielectric analysis (DEA) and differential scanning calorimetry (DSC) techniques were used to study the epoxy nanocomposites prepared by reacting 1, 3,5,7,9,11,13,15-octa[dimethylsiloxypropylglycidylether] pentaciclo [9.5.1.1 3,9 .1 5,15 .1 7,13 ] octasilsesquioxane (ODPG) with methylenedianiline (MDA). Loss factor (ε") and activation energy were calculated by DEA. The relationships between the loss factor, the activation energy, the structure of the network, and the mechanical properties were investigated. Activation energies determined by DEA and DSC, heat of polymerization, fracture toughness and tensile modulus show the same profile for mechanical properties with respect to ODPG content.

Recent Developments in the Chemistry of Cubic Polyhedral Oligosilsesquioxanes

“…Several examples of nanocomposites with different amines showing improved physical properties have been reported. 140,218,619,647,648,687,703,773 For example, the copolymerization of epoxide 188 with 4,4′-diaminodiphenylmethane in the presence of DGEBA gave a material with lower T g , better thermal stability, and higher modulus, thought to be arising from the reinforcement effect due to the POSS units. 71 The lifetime of such a system has been calculated, and it was found to be theoretically thermally stable for more than 30 years at 100 °C in the absence of other reagents.…”