2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) 2012
DOI: 10.1109/eptc.2012.6507071
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Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

Jiahuan Tang
1
,
E.G.J. Reinders2,
C. Th. A. Revenberg3
et al.
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Cited by 5 publications
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References 16 publications
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Concerns and Solutions

Chauhan
1
,
Choubey2,
Zhong
3
et al. 2013
Copper Wire Bonding
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Concerns and Solutions

Chauhan
1
,
Choubey2,
Zhong
3
et al. 2013
Copper Wire Bonding
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Microwave Induced Plasma decapsulation of thermally stressed multi-tier copper wire bonded IC packages

Tang1,
Knobben2,
Reinders3
et al. 2013
2013 14th International Conference on Electronic Packaging Technology
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Optimization of Microwave Induced Plasma Etching Process for Decapsulation of Multi-Tier PCC Wire-Bonded Semiconductor Devices

Liew,
Hasnizam,
Prodanović
et al. 2023
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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