Deep reactive ion etching of borosilicate glass using an anodically bonded silicon wafer as an etching mask

Akashi, T.; Yoshimura, Yasuhiro

doi:10.1088/0960-1317/16/5/024

Cited by 55 publications

(44 citation statements)

References 7 publications

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“…This means that DRIE was again carried out after the ultrasonic cleaning until the depth of the groove reached approximately 300 µm. [7]. The sidewall angle of the groove did not reach more than 80 o .…”

Section: Process For Control Of Groove Profilementioning

confidence: 92%

“…This paper reports on two fabrication processes for controlling the etching profile, namely for effectively removing excessive polymer film. The obtained experimental results are compared with previous ones [7].…”

Section: Introductionmentioning

confidence: 93%

“…One was DRIE with argon added to carbon-fluoride etching gases, i.e., C 4 and CHF 3 gases; the other was a novel combined process in which DRIE with a mixture of C 4 F 8 and argon gases and subsequent ultrasonic cleaning in DI water were alternately carried out. The former process means that the etching-gas composition was changed, compared with the previous conditions [7]. The latter process was carried out in step (e), shown in Figure 2.…”

Section: Process For Control Of Groove Profilementioning

confidence: 99%

“…A novel fabrication process that uses an anodically bonded silicon wafer as an etching mask reportedly overcomes the low selectivity and achieves much deeper etching [7]. In the process, carbon-fluoride gases, i.e., C 4 F 8 and CHF 3 , were used as etching gases.…”

Section: Introductionmentioning

confidence: 99%

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Profile control of a borosilicate-glass groove formed by deep reactive ion etching

Akashi¹,

Yoshimura²

2008

J. Micromech. Microeng.

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Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely improving its sidewall angle, by removing excessively thick polymer film produced by carbonfluoride etching gases during DRIE. Two fabrication processes were experimentally compared for effective removal of the film: DRIE with the addition of argon to the etching gases and a novel combined process in which DRIE and subsequent ultrasonic cleaning in DI water were alternately carried out. Both processes improved the sidewall angle, and it reached 85 o independent of the mask-opening width. The results showed the processes can remove excessive polymer film on sidewalls. Accordingly, the processes are an effective way to control the groove profile of borosilicate glass.

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Section: Process For Control Of Groove Profilementioning

confidence: 92%

Section: Introductionmentioning

confidence: 93%

Section: Process For Control Of Groove Profilementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Profile control of a borosilicate-glass groove formed by deep reactive ion etching

Akashi¹,

Yoshimura²

2008

J. Micromech. Microeng.

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“…The process requires a low pressure of 5-10 mTorr, since ion bombardment of the material (physical etching) plays an important role. The gas precursors used for deep etching of glass are SF 6 72 Additional gases such as He, H 2 , O 2 , or Ar may be added to control chamber pressure or for improving the quality of the etching process. Since the selectivity of the etching process is low, a relatively thick masking layer is required, such as electroplated Ni (20 lm-thick) for SF 6 chemistry, bulk silicon, 71 PECVD amorphous silicon (12 lm-thick), 70 or even a thick layer of SU-8 photoresist.…”

Section: Dry Etchingmentioning

confidence: 99%

A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

311

207

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This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow. I. WHY USE SILICON AND GLASS IN MICRO-AND NANO-FLUIDIC APPLICATIONS?Micro-and nano-fluidic technology continues to be embraced by biologists, 1-3 chemists, 4 and engineers throughout academia and industry. As its applications have expanded, there has been an explosion in the range of materials and processes used to fabricate these devices. The earliest microfluidic devices (e.g., gas 5 and liquid 6 chromatography devices) were made from silicon and glass and borrowed processes directly from semiconductor and microelectromechanical systems (MEMS) manufacturing. 7 Now, however, many researchers have moved away from silicon and glass, and instead use cast elastomers such as polydimethylsiloxane (PDMS)-which is ideal for swift prototyping-or thermoplastic polymers, which can be hot-embossed or injection-molded and are well suited to inexpensive manufacturing. Yet, there remain many applications where glass and silicon offer advantages over polymeric materials. In this paper, we highlight these advantages and offer a framework for selecting fabrication processes when using silicon and glass. A. The dominance of soft lithographyOver the last decade, PDMS has become virtually the default material for forming microfluidic devices, 8 because of the sheer ease with which it can be cast on to a micro-scale mould and then strongly bonded to glass. 9 The elastomeric nature of the material has been exploited to integrate fluidic valves and pumps on-chip and has simplified the production of multi-layer devices because the soft layers readily conform to each other. 10,11 Yet, the low stiffness (usually <1 MPa) of PDMS relative to amorphous thermoplastics, silicon, and glass has its own a) Authors to whom correspondence should be addressed. Electronic addresses: ciliescu@ibn.a-star.edu.sg and hkt@ntu.edu.sg. 6, 016505 (2012) drawbacks. High aspect-ratio channels are notoriously difficult to fabricate in PDMS because of their propensity to collapse. 12 Moreover, difficulties in automating the handling of such a soft material have hampered efforts to scale up PDMS device manufacturing. Meanwhile, PDMS's high oxygen and water permeabilities have proved both a blessing and a curse in different applications.The hydrophobic nature of PDMS can be an important consideration for some biological applications. In drug screening applications, for example, hydrophobic drugs as well as metabolites (urea or albumin) can be absorbed into the device's material due to hydrophobic--hydrophobic interaction...

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Microchip technology in mass spectrometry

Sikanen

Franssila

Kauppila

et al. 2009

Mass Spectrom. Rev.

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Microfabrication of analytical devices is currently of growing interest and many microfabricated instruments have also entered the field of mass spectrometry (MS). Various (atmospheric pressure) ion sources as well as mass analyzers have been developed exploiting microfabrication techniques. The most common approach thus far has been the miniaturization of the electrospray ion source and its integration with various separation and sampling units. Other ionization techniques, mainly atmospheric pressure chemical ionization and photoionization, have also been subject to miniaturization, though they have not attracted as much attention. Likewise, all common types of mass analyzers have been realized by microfabrication and, in most cases, successfully applied to MS analysis in conjunction with on-chip ionization. This review summarizes the latest achievements in the field of microfabricated ion sources and mass analyzers. Representative applications are reviewed focusing on the development of fully microfabricated systems where ion sources or analyzers are integrated with microfluidic separation devices or microfabricated pums and detectors, respectively. Also the main microfabrication methods, with their possibilities and constraints, are briefly discussed together with the most commonly used materials.

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Deep reactive ion etching of borosilicate glass using an anodically bonded silicon wafer as an etching mask

Cited by 55 publications

References 7 publications

Profile control of a borosilicate-glass groove formed by deep reactive ion etching

Profile control of a borosilicate-glass groove formed by deep reactive ion etching

A practical guide for the fabrication of microfluidic devices using glass and silicon

Microchip technology in mass spectrometry

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