Delphi-like dynamical compact thermal models using model order reduction

Rogié, Brice; Codecasa, Lorenzo; Monier-Vinard, Eric; Bissuel, Valentin; Laraqi, Najib; Daniel, Olivier; D'Amore, D.; Magnani, Alessandro; d’Alessandro, V.; Rinaldi, N.

doi:10.1109/therminic.2017.8233812

Cited by 28 publications

(5 citation statements)

References 7 publications

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“…• require quite large sets of time-consuming transient thermal simulations of the detailed model [15], Moreover, the BCI-DCTM accuracy cannot be chosen. This latter strongly depends on a smart selection of "Black-box" settlement details to approximate the DTM behavior.…”

Section: Delphi's Methods Constraintsmentioning

confidence: 99%

“…Based on these two visions for minimizing computational resources, a hybrid reduction method is promoted that suggests the integration of a reduced matrix model to calculate a set of Boundary Conditions, instead of a detailed model. By ensuring a low discrepancy between the detailed model and the ROM model, the time to build a DCTM can be drastically shortened as demonstrated in [15].…”

Section: Study Purposementioning

confidence: 99%

“…Therefore the creation flow, seen in Fig. 1, was modified [15] to insert an additional step using the FANTASTIC solver, which derives a ROM model, as pictured Fig. 2.…”

Section: Hybrid Dctm Creation Using Mor Techniquementioning

confidence: 99%

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Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Rogié

Codecasa

Monier-Vinard

et al. 2018

Microelectronics Reliability

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Delphi-like boundary condition independent (BCI) compact thermal models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI dynamical CTM (DCTM), based on model order reduction (MOR) were developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is proposed. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied, at first on a single-chip package (QFN16) then on a dual-chip package (DFN12). Their derived CTM and DCTM have been compared in term of accuracy and creation time using, or not, MOR reduction technique. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and consequently reduce the thermal network creation time by 80%.

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Section: Delphi's Methods Constraintsmentioning

confidence: 99%

Section: Study Purposementioning

confidence: 99%

See 1 more Smart Citation

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Rogié

Codecasa

Monier-Vinard

et al. 2018

Microelectronics Reliability

Self Cite

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“…References [30,31] are dedicated to parameters estimation of thermal models of electronics devices in the Delphi-inspired form. To this end, genetic algorithms are used.…”

Section: Introductionmentioning

confidence: 99%

Compact Thermal Model of the Pulse Transformer Taking into Account Nonlinearity of Heat Transfer

Górecki

Detka

Górski³

2020

Energies

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This paper presents a compact nonlinear thermal model of pulse transformers. The proposed model takes into account differentiation in values of the temperatures of a ferromagnetic core and each winding. The model is formulated in the form of an electric network realising electrothermal analogy. It consists of current sources representing power dissipated in the core and in each of the windings, capacitors representing thermal capacitances and controlled current sources modelling the influence of dissipated power on the thermal resistances in the proposed model. Both self-heating phenomena in each component of the transformer and mutual thermal couplings between each pair of these components are taken into account. A description of the elaborated model is presented, and the process to estimate the model parameters is proposed. The proposed model was verified experimentally for different transformers. Good agreement between the calculated and measured waveforms of each component temperature of the tested pulse transformers was obtained. Differences between the results of measurements and calculations did not exceed 9% for transformers with a toroidal core and 13% for planar transformers.

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“…Some of the authors have recently developed novel approaches [3][4][5][6][7][8][9] relying on model-order reduction (MOR) to the extraction of various families of CTMs. For the specific case of parametric CTMs (pCTMs) [4], the proposed MOR-based technique starts from the detailed thermal model (DTM) of an electronic component, some parameters of which (geometrical dimensions and thermal properties) are assumed to vary in a chosen set, either finite or infinite.…”

mentioning

confidence: 99%

TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages

et al. 2019

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This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages.

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Delphi-like dynamical compact thermal models using model order reduction

Cited by 28 publications

References 7 publications

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Compact Thermal Model of the Pulse Transformer Taking into Account Nonlinearity of Heat Transfer

TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages

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