Dependence of temperature profile parameters during the repair process on the size of BGA package and the type of solder alloy used

Witkowski, Piotr

doi:10.14313/par_230/25

PAR

2018

DOI: 10.14313/par_230/25

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Dependence of temperature profile parameters during the repair process on the size of BGA package and the type of solder alloy used

Piotr Witkowski¹

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Dependence of temperature profile parameters during the repair process on the size of BGA package and the type of solder alloy used

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