2020
DOI: 10.1016/j.est.2020.101960
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Design optimization of PCM-based finned heat sinks for mechatronic components: A numerical investigation and parametric study

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Cited by 48 publications
(8 citation statements)
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“…approached 100 W/cm 2 for advanced microprocessors while the heat fluxes dissipation limited to 37 W/cm 2 for air cooling [3], which ultimately increases the working temperature beyond the safe limit resulting in in-efficient performance and shorter life of the devices. The working temperature of electronic devices should be within 85°C -120°C to ensure the efficient performance of devices [4]. Hence an effective cooling method is needed for dissipating the excess heat flux generated.…”
Section: Modelmentioning
confidence: 99%
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“…approached 100 W/cm 2 for advanced microprocessors while the heat fluxes dissipation limited to 37 W/cm 2 for air cooling [3], which ultimately increases the working temperature beyond the safe limit resulting in in-efficient performance and shorter life of the devices. The working temperature of electronic devices should be within 85°C -120°C to ensure the efficient performance of devices [4]. Hence an effective cooling method is needed for dissipating the excess heat flux generated.…”
Section: Modelmentioning
confidence: 99%
“…Some literatures are available on the application of PCM in micro-channel heat sink for dissipating heat fluxes from electronic devices. Debich et al [4] numerically investigated the heat sink based on PCM to find best configuration of heat sink. Analysis is established on the comparison of experimental results of heat sink with and without PCM.…”
Section: Modelmentioning
confidence: 99%
“…Accordingly, various techniques have been modelled to improve the heat transfer efficiency of the PCM during the charging and discharging methods [18]. These techniques include a combination with the high conductive materials (nanoparticles) [19][20][21][22][23], utilizing an extended surface area for the heat transfer (fins) [21,[24][25][26], combinations with the metal foam [27][28][29][30][31], and using more efficient geometries designs [28,32,33]. Moreover, natural convection is a critical mechanism that can assist the phase change heat transfer in molten regions.…”
Section: Introductionmentioning
confidence: 99%
“…Phase change material (PCM) has been commonly used in heat exchangers [1,2], solar energy storage systems [3][4][5][6][7], and electronic component thermal management systems [8][9][10][11] due to its stable phase change temperature and high energy storage density. With the development of electronic devices to miniaturization and high power, higher requirements are put forward for their heat dissipation performance [12,13].…”
Section: Introductionmentioning
confidence: 99%