2017
DOI: 10.1007/s10854-017-7260-4
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Determination of micro sized texturing and nano sized etching procedure to enhance optical properties of n-type single crystalline silicon wafer

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Cited by 10 publications
(2 citation statements)
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“…However, this also makes the texturing of DWS wafers much more complicated than MWSS wafers. While the lack of deep and dense saw damage is not an issue in sc-Si wafers that use alkaline texturing 17 , mc-Si texturing using the standard anisotropic acidic micro-texturing process is not applicable as it is known to require deep saw damage to be effective 6,8,18 . In addition, due to the difference between the acidic and alkaline micro-texturing processes, the equipment used for sc-Si and mc-Si are different.…”
Section: Introductionmentioning
confidence: 99%
“…However, this also makes the texturing of DWS wafers much more complicated than MWSS wafers. While the lack of deep and dense saw damage is not an issue in sc-Si wafers that use alkaline texturing 17 , mc-Si texturing using the standard anisotropic acidic micro-texturing process is not applicable as it is known to require deep saw damage to be effective 6,8,18 . In addition, due to the difference between the acidic and alkaline micro-texturing processes, the equipment used for sc-Si and mc-Si are different.…”
Section: Introductionmentioning
confidence: 99%
“…Energy and energy production costs have a crucial factor on the development and sustainability the countries [1]. Hence, the alternative energy sources are important to reduce the unfavorable effects of fossil fuel energy sources.…”
Section: Introductionmentioning
confidence: 99%