Developing a novel binderless diamond grinding wheel with femtosecond laser ablation and evaluating its performance in grinding soft and brittle materials

Qu, Meina; Jin, Tan; Xie, Guizhi; Cai, Rui

doi:10.1016/j.jmatprotec.2019.116359

Cited by 16 publications

(7 citation statements)

References 17 publications

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“…Vision sensors are at the core of this technology, so that in an established monitoring system, an optical sensor can be combined with a vision sensor, an X-ray system with a high-speed camera, a sound sensor assembled with a vision sensor, etc. In order to achieve various monitoring objectives, such as parameter optimization, feature prediction, seam tracking, defects classification, simulation validation or adaptive control, a variety of AI techniques can be applied (Cai, 2020). Laser beam welding is a high-quality fusion joining process that enables the welding of dissimilar components, e.g., titanium alloys with various counterparts including steel, aluminum, magnesium, nickel, niobium, copper, etc.…”

Section: Laser Beam Machining Methodsmentioning

confidence: 99%

“…There are also reports on the fabrication of a binderless diamond grinding wheel (BDGW) intended to prevent impurities from embedding during the machining of soft and brittle materials. The "binder" features, as well as the "grains," were produced on a single piece of chemical vapor deposition diamond, while the "grains" were ablated with a femtosecond laser (Qu et al, 2020).…”

Section: Diamond and Electrical Discharge Diamond Grindingmentioning

confidence: 99%

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Remanufacturing and Advanced Machining Processes for New Materials and Components

Gevorkyan¹,

Rucki²,

Nerubatskyi³

et al. 2022

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Reasonable efforts have been made to publish reliable data and information, but the author and publisher cannot assume responsibility for the validity of all materials or the consequences of their use. The authors and publishers have attempted to trace the copyright holders of all material reproduced in this publication and apologize to copyright holders if permission to publish in this form has not been obtained. If any copyright material has not been acknowledged please write and let us know so we may rectify in any future reprint.The Open Access version of this book, available at www.taylorfrancis.com, has been made available under a Creative Commons Attribution-Non Commercial-No Derivatives 4.0 license.

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Section: Laser Beam Machining Methodsmentioning

confidence: 99%

Section: Diamond and Electrical Discharge Diamond Grindingmentioning

confidence: 99%

Remanufacturing and Advanced Machining Processes for New Materials and Components

Gevorkyan¹,

Rucki²,

Nerubatskyi³

et al. 2022

View full text Add to dashboard Cite

show abstract

“…However, in the grinding of soft-brittle materials, impurity embedding and poor ground surface quality are likely to occur under conventional grinding conditions [44]. To overcome this difficulty, researchers conducted a lot of attempts, including the optimization of grinding parameters [133], development of proper grinding fluid [134], and design of a binderless grinding wheel [135], and so on. Among them, the diamond grit's geometry considerably influences the quality of the machined surface [136].…”

Section: Ultraprecision Grindingmentioning

confidence: 99%

Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review

Huang

Yan

2023

Int. J. Extrem. Manuf.

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Brittle materials are widely used for producing important components in the industry of optics, optoelectronics, and semiconductors. Ultraprecision machining of brittle materials with high surface quality and surface integrity helps improve the functional performance and lifespan of the components. According to their hardness, brittle materials can be roughly divided into hard-brittle and soft-brittle ones. Although there have been some literature reviews for ultraprecision machining of hard-brittle materials, up to date, very few review papers are available that focus on the processing of soft-brittle materials. Due to the “soft” and “brittle” properties, this group of materials has unique machining characteristics. This paper presents a comprehensive overview of recent advances in ultraprecision machining of soft-brittle materials. Critical aspects of machining mechanisms such as chip formation, surface topography, and subsurface damage for different machining methods, including diamond turning, micro end milling, ultraprecision grinding, and micro/nano burnishing, are compared in terms of tool-workpiece interaction. The effects of tool geometries on the machining characteristics of soft-brittle materials are systematically analyzed, and dominating factors are sorted out. Problems and challenges in the engineering applications are pointed out, and solutions/guidelines for future R&D are provided.

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“…The fluence, however, should not exceed a certain value, specific for a given diamond sample, to avoid the thermal damage and an uncontrolled increase of the HAZ in the focal volume. The fs-pulsed lasers are able to generate extremely high-power density (up to a few GW) at relatively low average laser power (as low as 100 mW) [92], high enough to dissociate C-C covalent bonds in a diamond lattice. Graphitization occurs by electrons absorbing energy through an inverse bremsstrahlung process and, thus facilitating a transition from an sp 3 tetrahedral to an sp 2 aromatic and/or an sp 2 olefinic bonding state [93].…”

Section: Fslaser Micromachining Of Diamondmentioning

confidence: 99%

“…Ultrashort pulsed laser ablation systems are technologically advanced tools capable of processing various materials at extremely high peak powers (up to few GW), while delivering a highly localized energy that enables a non-thermal ablation of even transparent and lowabsorption samples with high precision and accuracy [92]. Active and passive mode-locked oscillators generate ultrashort pulses, that require amplification to reach the desired energy levels to process diamond above its ablation threshold (i.e., at or above 3 J/cm 2 [31], see Section 2.1).…”

Section: Common Fs-laser Micromachining Systemsmentioning

confidence: 99%

Femtosecond laser micromachining of diamond: Current research status, applications and challenges

Ali

Litvinyuk

Rybachuk

2021

Carbon

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Ultra-fast femtosecond (fs) lasers provide a unique technological opportunity to precisely and efficiently micromachine materials with minimal thermal damage owing to the reduced heat transfer into the bulk of the work material offered by short pulse duration, high laser intensity and focused optical energy delivered on a timescale shorter than the rate of thermal diffusion into the surrounding area of a beam foci. There is an increasing demand to further develop the fs-machining technology to improve the machining quality, minimize the total machining time and increase the flexibility of machining complex patterns on diamond. This article offers an overview of recent research findings on the application of fs-laser technology to micromachine diamond. The laser technology to precisely micromachine diamond is discussed and detailed, with a focus on the use of fs-laser irradiation systems and their characteristics, laser interaction with various types of diamonds, processing and the subsequent post-processing of the irradiated samples and, appropriate sample characterisation methods. Finally, the current and emerging application areas are discussed, and the challenges and the future research prospects in the fs-laser micromachining field are also identified.

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Developing a novel binderless diamond grinding wheel with femtosecond laser ablation and evaluating its performance in grinding soft and brittle materials

Cited by 16 publications

References 17 publications

Remanufacturing and Advanced Machining Processes for New Materials and Components

Remanufacturing and Advanced Machining Processes for New Materials and Components

Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review

Femtosecond laser micromachining of diamond: Current research status, applications and challenges

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