Development and Reliability study of 3D WLCSP for automotive CMOS image sensor using TSV technology

Ma, Shuying; Liu, Yi; Zheng, Fengxia; Li, Feng; Xiao, Aimo; Yang, Xiaobing

doi:10.1109/ectc32862.2020.00080

Cited by 7 publications

(2 citation statements)

References 6 publications

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“…The glass cover not only prevents contaminants from entering the chip and protects the chip's internal circuitry, but also facilitates the entry of light into the chip's surface light-sensitive unit through the cavity. According to the package form, CMOS image sensors are divided into plastic package and ceramic package [2]. The structure of the two package forms is basically the same, including optical glass cover, package shell, chip and internal leads, pins.…”

Section: Introductionmentioning

confidence: 99%

Discussion of Mechanical Shock Test Stress for Ultra-large-scale CMOS Image Sensors

Xiong,

Rui,

Tian

et al. 2024

J. Phys.: Conf. Ser.

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The ultra-large-scale CMOS image sensors are significantly different from the traditional CMOS image sensors in terms of pixel size, chip size and structure. CMOS image sensors generally come with an optical window structure that is sealed to the ceramic housing by means of adhesive. The optical window material is generally sapphire, and the larger the image element size, the larger the required glass optical window area. Ultra-large size CMOS image sensors in the package before the general optical window thickness, parallelism, light window average transmittance assessment. The object of mechanical impact test assessment is the CMOS image sensor optical window structure and capping process. The paper mainly discusses the typical failure cases of ultra-large-scale CMOS image sensors on the basis of the applicability of mechanical shock test standards, and investigates how to define the mechanical shock test stress from simulation, limit test and the requirements by users. This paper provides the qualification assessment basis of mechanical shock for newly developed products.

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Section: Introductionmentioning

confidence: 99%

Discussion of Mechanical Shock Test Stress for Ultra-large-scale CMOS Image Sensors

Xiong,

Rui,

Tian

et al. 2024

J. Phys.: Conf. Ser.

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show abstract

“…With the continuous advancements in their integrated circuit design and manufacturing technology, smartphone cameras are increasingly improving sensitivity, resolution, and dynamic range with reduced power consumption [ 32 , 33 ]. These cameras have even been applied to smart cars, which are more demanding than smartphones [ 34 ]. These advantages enable smartphones to be used as readout tools for portable colorimetric biosensors to measure color and intensity changes effectively.…”

Section: Introductionmentioning

confidence: 99%

A Real-Time Detection Method of Hg2+ in Drinking Water via Portable Biosensor: Using a Smartphone as a Low-Cost Micro-Spectrometer to Read the Colorimetric Signals

Jiao

Cao

et al. 2022

Biosensors

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This paper reported a real-time detection strategy for Hg2+ inspired by the visible spectrophotometer that used a smartphone as a low-cost micro-spectrometer. In combination with the smartphone’s camera and optical accessories, the phone’s built-in software can process the received light band image and then read out the spectral data in real time. The sensor was also used to detect gold nanoparticles with an LOD of 0.14 μM, which are widely used in colorimetric biosensors. Ultimately, a gold nanoparticles-glutathione (AuNPs-GSH) conjugate was used as a probe to detect Hg2+ in water with an LOD of 1.2 nM and was applied successfully to natural mineral water, pure water, tap water, and river water samples.

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Fan-In Wafer/Panel-Level Chip-Scale Packages

Lau

2021

Semiconductor Advanced Packaging

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Development and Reliability study of 3D WLCSP for automotive CMOS image sensor using TSV technology

Cited by 7 publications

References 6 publications

Discussion of Mechanical Shock Test Stress for Ultra-large-scale CMOS Image Sensors

Discussion of Mechanical Shock Test Stress for Ultra-large-scale CMOS Image Sensors

A Real-Time Detection Method of Hg2+ in Drinking Water via Portable Biosensor: Using a Smartphone as a Low-Cost Micro-Spectrometer to Read the Colorimetric Signals

Fan-In Wafer/Panel-Level Chip-Scale Packages

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