Development of micro assembly processes for further miniaturization in electronics production

Feldmann, Klaus; Franke, Jöerg; Schüßler, Florian

doi:10.1016/j.cirp.2010.03.005

Cited by 23 publications

(10 citation statements)

References 4 publications

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“…The miniaturization of electronics is a very important technology, which means the engineering of smaller mechanical, optical and electronic items and devices. [15]. It is the key enabler for Automatic Identification and Data Collection (AIDC) and Radio Frequency Identification (RFID) technologies that help to capture, handle and analyze data in transport processes in the supply chain [16].…”

Section: Research Backgroundmentioning

confidence: 99%

Application of Fuzzy DEMATEL Method on the Impact of IT innovation on Supply Chain Management of Food Industry in Nigeria

Boye

2021

SAJSSE

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Supply chain management can be viewed as an important part of a company's strategic strategy for increasing efficiency, results, and profitability. The aim of this paper is to us the fuzzy DEMATEL method to examine the impact of IT innovation on the operations of supply chain management of food industry in Nigeria. The study obtained sixteen (16) perspectives of impact of IT innovation on food industry SC management as obtain from literature and brain stormy of experts. A fuzzy Linguistic scale was developed and applies it to food manufacturing firms in Nigeria to test the level of the impact of IT innovation on supply chain management. The questionnaire designed for pairwise comparison to evaluate the influence of each score, where scores of 0, 1, 2, 3 and 4 represent: (no influence), (Very low influence), (low influence), (high influence) and (very high influence), respectively. Twelve experts were asked to complete the questionnaire comprises of 6 general managers, 6 Supply Chain managers all of food industry. Then the Fuzzy DEMATEL method was applied to analyze the importance of criteria and the casual relations among the criteria constructed. The result showed that the advanced planning system had the most impact and the strongest link to other criteria. As a result, APS is a key rationale and key criteria that influence other criteria and driving factors to solve problems.

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Section: Research Backgroundmentioning

confidence: 99%

Application of Fuzzy DEMATEL Method on the Impact of IT innovation on Supply Chain Management of Food Industry in Nigeria

Boye

2021

SAJSSE

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“…The use of underfill can reduce shear strain in solder joints about 75 % to 90 % [14] [15]. Material properties, like Young's modulus and CTE of the underfill, filler particle size and content, chip size, I/O layout, surface energies, gap height, voids, and flux residues significantly influence the quality of the underfilled components [16][17] [18] [19].…”

Section: Investigation Of Underfillmentioning

confidence: 99%

Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

Oppert¹,

Dohle

Franke³

et al. 2011

International Symposium on Microelectronics

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The most important technology driver in the electronics industry is miniaturization mainly driven by size reduction on wafer level and cost. One of the interconnection technologies for fine pitch applications with the potential for highest integration and cost savings is Flip Chip technology. The commonly used method of generating fine pitch solder bumps is by electroplating the solder. This process is difficult to control or even impossible if it comes to ternary or quaternary alloys. The work described in this study addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping and the use of a very large variety of solder alloys. This flexibility in the selection of the solder materials and UBM stacks is a large advantage if it is essential to improve temperature cycling resistance, drop test resistance, or to increase electromigration lifetime. The technology allows rapid changeover between different low melting solder alloys. Tighter bump pitches and a better bump quality (no flux entrapment) are achievable than with screen printing of solder paste. Because no solder material is wasted, the material costs for precious metal alloys like Au80Sn20 are much lower than with other bumping processes. Solder bumps with a diameter between to date 30 μm and 500 μm as well as small and large batches can be manufactured with one cost efficient process. To explore this potential, cost-efficient solder bumping and automated assembly technologies for the processing of Flip Chips have been developed and qualified. Flip Chips used in this study are 10 mm by 10 mm in size, have a pitch of 100 μm and a solder ball diameter of 30 μm, 40 μm or 50μm, respectively. Wafer level solder application has been done using wafer level solder sphere transfer process or solder sphere jetting technology, respectively. The latter tool has been used for many years in the wafer level packaging industry for both Flip Chip and chip scale packaging applications. It is commonly known in the industry as a solder ball bumping equipment. For the described work the process was scaled down for processing solder spheres with a diameter of 30 μm what was never done before that way worldwide. The research has shown that the underfill process is one of the most crucial factors when it comes to Flip Chip miniaturization for high reliability applications. Therefore, high performance underfill material was qualified initially [1]. Final long term reliability testing has been done according to MIL-STD883G, method 1010.8, condition B up to thirteen thousand cycles with excellent performance of the highly miniaturized solder joints. SEM/EDX and other analysis techniques will be presented. Additionally, an analysis of the failure mechanism will be given and recommendations for key applications and further miniaturization will be outlined.

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“…The everincreasing demand for miniaturization across industrial sectors possesses big challenges for metallization and selective metallization processes. As the further miniaturization and reduction in the part's size are a technological reality [6], it is important to know the effects of miniaturization on the quality of metallization. Almost nothing is reported on this issue at the state-of-the-art.…”

Section: Introductionmentioning

confidence: 99%

Effects of Miniaturization on the Quality of Metallized Plastic Parts

Islam

Hansen

2022

Micromachines

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The metallization of plastics is an important industrial process. Plastics are metallized for both aesthetic and functional purposes. The unceasing pursuit towards the miniaturization and reduction in the part’s size challenges the already complicated process of metallization. A rigorous research study uncovering the effects of miniaturization on the quality of metallized parts is missing at the state-of-the-art level. This study focuses on the quality of the deposited metal film based on geometrical dimensions and systematically characterizes the effects of miniaturization on the metallized micro-components. The experimental results presented in this paper reveal the hidden synergy among the metallization quality, part dimension, and process conditions used both for substrate fabrication and for metallization. The paper broadens the fundamental understanding about the interactions of various design, materials, and process parameters involved in the manufacturing process chain. The results and discussions presented in this paper will be valuable sources of information to deal with the integration of micrometallic structures on polymeric substrates for high precision applications.

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Development of micro assembly processes for further miniaturization in electronics production

Cited by 23 publications

References 4 publications

Application of Fuzzy DEMATEL Method on the Impact of IT innovation on Supply Chain Management of Food Industry in Nigeria

Application of Fuzzy DEMATEL Method on the Impact of IT innovation on Supply Chain Management of Food Industry in Nigeria

Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

Effects of Miniaturization on the Quality of Metallized Plastic Parts

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