Development of Polyester-Modified Epoxy Resins for Self-Organization Soldering

Abstract

Novel underfill resins combining a thermoset epoxy resin with thermoplastic polyester resins have been developed for self-organization soldering. Polyester-modified epoxy resins, which are hybrid resins, exhibited minimal viscosity at the melting point of the Sn58 mass%Bi solder, with the viscosity dependent on the content and molecular mass of the blended polyester resin. Because the epoxy resin was sufficiently compatible with the polyester resin in the hybrid, the curing reaction of the hybrid resin was similar to that of the epoxy resin. The chemical structure of the polyester resin was retained in the cured hybrid resin, imparting thermoplasticity to the hybrid resins cured with repeated heating. Successful self-organization soldering was achieved using the developed hybrid-resin-based solder paste. [

High performance epoxy/polyester-based nanocomposite coatings for multipurpose applications: A review

“…38 Compatibility in epoxy/polyesters is an essential parameter to enhance a coating's corrosion resistance and mechanical properties. [39][40][41] Epoxy/polyester coatings show corrosion resistance in addition to flexibility, anti-aging, and anti-weathering characteristics. 42,43 Mafi et al 44 designed epoxy/polyester and nanocomposite coatings.…”

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

“…The enhancement effect of the ESP on the lifetime of solder joints has been clearly recognized by thermomechanical reliability analysis [ 14 , 15 ]. Fukumoto et al introduced thermoplastic polyester resins into ESPs consisting of epoxy-based thermoset resins, curing agents, and diethyl glutaric acid as the reducing agent for self-organization soldering [ 16 ] and prevention of spreading of the ESP [ 17 ]. S.-B.…”

Recent Development of Joining and Conductive Materials for Electronic Components

“…6). 17) The issue introduces research related to electronic materials: evaluations of mechanical properties of solder alloys 1821) and metal materials used in electronic equipment parts, 22) investigation of intermetallic compounds formed on bonding wires, 23) development of resin materials, 24) and evaluations of fatigue properties of sintered materials, 25) solder alloys 26) and underfill resin. 27) From these special issues, there are 18 researches on joining materials and 4 researches on conductive materials, which shows the importance of these materials.…”