2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00012
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Development of Wafer Level Process for the Fabrication of Advanced Capacitive Fingerprint Sensors Using Embedded Silicon Fan-Out (eSiFO(R)) Technology

Shuying Ma1,
Chengqian Wang2,
Fengxia Zheng3
et al.
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