Abstract:Modern high performance, high density integrated circuits use a very large number of metal layers, necessitating the need to deal with the problem of resistive open defects. Resistive opens often manifest as and are modeled as small delay faults.
Furthermore, in deep sub-micron technologies, it is known that the additional delay of a line with resistive open fault is not only a function of the resistant of the faulty line but it is also dependent on the signal transition(s) on its adjacent lines. In this paper… Show more
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