Dielectric properties and thermal conductivity of epoxy composites using quantum-sized silver decorated core/shell structured alumina/polydopamine

Wang, Kuikui; Yang, Mengmeng; Liu, Jingya; Xiao, Bing; Chen, Siyu; Huang, Jialiang; Xie, Qianqian; Wu, Guanglei; Wu, Hongjing

doi:10.1016/j.compositesa.2018.12.022

Cited by 192 publications

(75 citation statements)

References 68 publications

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“…On that note, recently, Pan et al incorporated combination of hexagonal boron nitride (hBN) and AlN of different size in polytetrafluoroethylene polymer and found appreciable enhancement on the conductive behavior of developed material. Similarly, Wang et al used combination of silver and alumina to fabricate epoxy‐based composites and reported improvement in the thermal conductivity of epoxy. The key properties of the composite material are dependent on various parameters such as content of filler, number of phases, intrinsic properties of phases, interaction between the filler and matrix, and the method of preparation of composites .…”

Section: Introductionmentioning

confidence: 99%

Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites

Agrawal

Chandrakar

2019

Polymer Composites

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Physical, mechanical, thermal, and dielectric behavior of surface modified hexagonal boron nitride (hBN) in epoxy matrix was investigated in this paper. Effective treatment of microsize boron nitride involved silane coupling agent, (γ‐aminopropyl)triethoxysilane such that the coating resulted from the treatment amounted to 2% of the weight of silane coupling agent of the treated BN. The present work revealed that the chemical treatment of BN surface could effectively enhance the adhesion between matrix and filler material. The dispersion and wettability of the BN powder in epoxy matrix after surface treatment were improved. These imparted improved physical and excellent mechanical and thermal properties to the developed material. The experimental study on thermal properties of fabricated composites indicated that incorporation of modified particles exhibits improved glass transition temperature. As filler loading increases, coefficient of thermal expansion of composite decreases which further decreases when treated filler were used. Further, appreciable improvement in thermal conductivity is obtained when treated hBN is used in place of untreated one. The dielectric properties are investigated for wide frequency range and filler content and found to be increased with hBN content and decrease with frequency enhancement. Furthermore, mechanical properties of such composites were also largely enhanced when treated fillers were used. With modified properties, the presently developed material is suitable for microelectronic applications.

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Section: Introductionmentioning

confidence: 99%

Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites

Agrawal

Chandrakar

2019

Polymer Composites

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“…Scheme 2 illustrates the custom-made test equipment. The volume resistivity could be calculated according to Equation (3) [55][56][57]:…”

Section: Resistance Change In Stretching At Different Temperaturesmentioning

confidence: 99%

Preparation of Ionic Liquid-Coated Graphene Nanosheets/PTFE Nanocomposite for Stretchable, Flexible Conductor via a Pre-Stretch Processing

Kou

et al. 2019

Nanomaterials

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The various volume concentrations of ionic liquid-modified graphene nanosheets filled polytetrafluoroethylene nanocomposites (IL-GNs/PTFE) for flexible conductors were fabricated via a pre-stretch processing method after cold-press sintering. The results indicated that pre-stretching has no significant weakening in the electrical conductivity of the nanocomposites, while the Young’s modulus greatly reduced by 62.5%, which is more suitable for flexible conductors. This may be because the reduced conductivity by the destructive conductive pathway cancels out the enhanced conductivity by the increased interlamellar spacing of IL-GNs via a pre-stretch processing, and the nanocomposite exhibits a phase transition from two to three-phase (with the introduction of an air phase) during pre-stretching. It was also found that the tensile strength of the nanocomposites was enhanced by 42.9% and the elongation at break and thermal conductivity decreased slightly with the same filler content after pre-stretching. The electrical conductivity of the pre-stretched nanocomposites tended to stabilize at 5.5 × 10−2 s·m−1, when the volume content of the packings achieved a percolation threshold (1.49 vol%). Meanwhile, the electrical resistivity of the pre-stretched 3.0 vol% IL-GNs/PTFE nanocomposite was slightly reduced by 0.30%, 0.38%, and 0.87% respectively after 180° twisting, 180° bending, and 10% stretching strain for 1000 cycles.

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“…For example, the dissipation factor of 44.4 vol% h-BN filled composite is reduced to below 0.007. A low and stable dielectric loss is beneficial in reducing power loss and heat production, which, in turn, results in increased operating speeds and reduced crosstalk [26].…”

Section: Electrical Propertiesmentioning

confidence: 99%

“…Compared to epoxy, it exhibits excellent fracture toughness, low water absorption, high volume resistivity and dielectric strength. Further, the addition of suitable type, size and volume fraction of reinforcements modifies its electrical, mechanical and optical properties [22][23][24][25][26][27][28].…”

Section: Introductionmentioning

confidence: 99%

Polycarbonate–hexagonal boron nitride composites with better dielectric properties for electronic applications

et al. 2019

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Hexagonal boron nitride (h-BN) reinforced polycarbonate (PC) composites were fabricated using solution method followed by hot pressing. The content of h-BN was varied from 0 to 60 wt% (~ 44.4 vol%). The morphology, electrical volume resistivity, microhardness, and dielectric properties of the composites were characterized. Scanning electron microscopy showed uniform dispersion of h-BN particles in the PC matrix. X-ray diffraction and Fourier transforms infrared spectroscopy showed no change in morphology of PC present in the composites. The dielectric constant of the composites containing 60 wt% h-BN increased to 3.9. The dissipation factor of the composites reduced to less than 0.007 and the dispersion in dielectric constant of the composites became stable over the frequency from 1 kHz to 10 MHz compared to that of pure PC. The electrical volume resistivity of the composites remained close to that of pure PC. The microhardness increased approximately 25% at 50 wt% h-BN content and thereafter, a slight decrease in microhardness was observed.

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Dielectric properties and thermal conductivity of epoxy composites using quantum-sized silver decorated core/shell structured alumina/polydopamine

Cited by 192 publications

References 68 publications

Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites

Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites

Preparation of Ionic Liquid-Coated Graphene Nanosheets/PTFE Nanocomposite for Stretchable, Flexible Conductor via a Pre-Stretch Processing

Polycarbonate–hexagonal boron nitride composites with better dielectric properties for electronic applications

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