Dielectric properties of the polymerization of an aromatic polyimide

Kranbuehl, David E.; Delos, S. E.; Jue, P. K.

doi:10.1016/0032-3861(86)90350-2

Cited by 60 publications

(22 citation statements)

References 8 publications

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“…The dielectric parameters and conductivity were used to obtain more detailed information with regard to the microscopic structure of the composites. These values were calculated from the capacitance and conductance using the following equations: [32][33][34][35][36][37][38] e 0 ¼ C p material where e¢ and e 00 are the real and imaginary parts of the complex dielectric constant e * . The real part measures the alignment of the dipoles, and the imaginary part represents the energy required to align the dipoles and move the ions.…”

Section: Electrical and Dielectric Propertiesmentioning

confidence: 99%

Polyaniline-doped benzene sulfonic acid/epoxy resin composites: structural, morphological, thermal and dielectric behaviors

Belaabed

Lamouri

Naar

et al. 2010

Polym J

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Conducting polymer composites, which are simply physical mixtures of an insulating polymer matrix and intrinsically conducting polymers, are promising new materials for various applications such as antistatic coatings, shielding and electromagnetic absorbers. In this context, a novel conducting composite was successfully produced. It is based on epoxy resin and polyaniline (PANI) doped in benzene sulfonic acid, which was used as conducting filler. The effect of PANI loading levels on the structural, morphological, thermal, electrical and dielectric properties was explored using techniques, such as Raman, Fourier transform infrared and ultraviolet-visible-NIR spectroscopy, X-ray diffraction, atomic force microscopy, scanning electron microscopy, thermogravimetric analysis and differential scanning calorimetry. The electrical behavior and morphology of the synthesized PANI revealed disorder and defects. In addition, as the applied voltage is increased, the current through the sample increases rapidly. The conductivity and dielectric properties were also investigated at room temperature in the frequency range of 1 MHz-1 GHz. The dielectric constant was shown to increase with increased loading at low frequencies and then decreases rapidly, reaching a constant value at higher frequencies. In addition, the AC conductivity of the prepared composites increases with the addition of PANI and is higher at high frequencies. Furthermore, the stability of the composites was found to be influenced by increasing the amount of PANI filler in the matrix.

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Section: Electrical and Dielectric Propertiesmentioning

confidence: 99%

Polyaniline-doped benzene sulfonic acid/epoxy resin composites: structural, morphological, thermal and dielectric behaviors

Belaabed

Lamouri

Naar

et al. 2010

Polym J

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show abstract

“…These parameters have been calculated from the capacitance (C, in Farads) and conductance (G, in Siemens) of the materials using the following equations: [29][30][31][32][33][34][35] e 0 ¼ C p ðsampleÞ =C 0 ; ð5Þ…”

Section: Dielectric Propertiesmentioning

confidence: 99%

Curing kinetics, thermomechanical and microwave behaviors of PANI-doped BSA/epoxy resin composites

Belaabed¹,

Lamouri²,

Wojkiewicz

2011

Polym J

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This work focuses on the elaboration and characterization of conducting polymer composites based on polyaniline (PANI) dispersed in an epoxy resin (ER) matrix and cured using an anhydride without a catalyst. PANI-doped benzene sulfonic acid was successfully synthesized in this manner and used as conducting filler. The effect of heating rate and PANI loading level on the curing process was investigated by differential scanning calorimetry in the dynamic mode. Furthermore, the phase structure, viscoelastic behavior and hardness of the composites were explored by dynamic mechanical thermal analysis and Vickers tests. The structure and morphology of the samples were investigated by scanning electron microscopy, which revealed behavior that varied as a function of the concentration of PANI in the composites. Dielectric properties were investigated up to 1 MHz. The electromagnetic shielding effectiveness of the composites was measured in the microwave band from 8 to 18 GHz. It was found that the electrical properties of PANI were influenced by elevated curing temperature of the ER, a variable that significantly affected the composite characteristics. In addition, the dielectric properties, curing parameters, viscoelasticites and electromagnetic behaviors of the composites were affecting by increasing the concentration of PANI filler in the matrix.

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“…Both the course of a reaction and the effects of age 'and moisture on a polymer's cure cycle can be monitored by DDA [2,3]. e" is sensitive to the ability of dipolar or ionic species to rotate or translate in the polymeric medium.…”

Section: Reaction Advancement and Effect Of Moisturementioning

confidence: 99%

“…DDA is particularly important to process control because it is one of only a few experimental techniques for conveniently studying the cure process continuously, that is, to examine the cure chemistry throughout the process of going from a monomeric liquid of varying viscosity to a crosslinked, insoluble; high temperature solid [1][2][3]. The key for achieving this goal is to relate the chemistry of the cure process to the dielectric properties of the polymer system by correlating time, temperatur~ and frequency dependent dielectric measurements with other chemical characterization methods.…”

mentioning

confidence: 99%

Dynamic Dielectric Analysis for Nondestructive Cure Monitoring and Process Control

Kranbuehl

Delos

Hoff

et al. 1987

Review of Progress in Quantitative Nondestructive Evaluation

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Dielectric properties of the polymerization of an aromatic polyimide

Cited by 60 publications

References 8 publications

Polyaniline-doped benzene sulfonic acid/epoxy resin composites: structural, morphological, thermal and dielectric behaviors

Polyaniline-doped benzene sulfonic acid/epoxy resin composites: structural, morphological, thermal and dielectric behaviors

Curing kinetics, thermomechanical and microwave behaviors of PANI-doped BSA/epoxy resin composites

Dynamic Dielectric Analysis for Nondestructive Cure Monitoring and Process Control

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