Differential Split-Ring Resonator-Based Antenna at 140 GHz in Embedded Wafer Level Ball Grid Array Technology

Bekker, Elizabeth; Bhutani, Akanksha; Oliveira, Lucas Giroto de; Antes, Theresa; Zwick, Thomas

doi:10.23919/eumc54642.2022.9924286

Cited by 4 publications

(6 citation statements)

References 15 publications

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“…The SSRR had the highest gain, for a single antenna element, in eWLB packaging technology, above 100 GHz, to date. The work presented here is an extension of work first presented in [14].…”

Section: Aip In Ewlbmentioning

confidence: 87%

“…To the best of the authors' knowledge, a differential eSRR AiP, with a horn-shaped reflector, which improves the peak gain by roughly 2.3 dB, is demonstrated here for the first time. The modified package concept results in a single antenna element with a peak gain surpassing that of [14], and is thus the highest to date.…”

Section: (B)mentioning

confidence: 99%

“…Regarding wideband antennas centered around 140 GHz, a single-ended corner patch element from [11] and results for a dipole, bow-tie, and rhombic differential antenna [12] have been published. The round SRR antenna from [13] and the differential, square SRR (SSRR) antenna from [14] are significant contributions in this area. The SSRR had the highest gain, for a single antenna element, in eWLB packaging technology, above 100 GHz, to date.…”

Section: Aip In Ewlbmentioning

confidence: 99%

“…This idea leads to the proposed modified package concept illustrated in Fig. 1(b), where a horn-shaped reflector is manufactured in the PCB, instead of a planar reflector as was custom in previous publications [11]- [14].…”

Section: Esrr Antennamentioning

confidence: 99%

“…In both cases, the PCB substrate is 508 𝜇m thick with a 2.25 × 2.25 mm 2 reflector on the PCB. The RO4003C simulation results are included here, to ease comparison with prior works [11]- [14] that used a similar substrate. The impedance bandwidth of the three different scenarios are similar -the reflection coefficient is below −10 dB from 127 to 166 GHz (a relative bandwdith of 26.9%).…”

Section: Esrr Antennamentioning

confidence: 99%

See 4 more Smart Citations

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar

Bekker,

Gramlich,

Valenziano

et al. 2024

Int. J. Microw. Wireless Technol.

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A system-in-package for a wideband digital radar, in D-band, requires broadband, high-gain antennas combined with broadband chip-to-package and package-to-printed circuit board (PCB) interconnects. This paper demonstrates a wideband, low-loss quasi-coaxial signal transition, and a novel electric split ring resonator (eSRR)-based antenna-in-package (AiP) with a modified reflector concept, for improved gain, in embedded wafer level ball grid array (eWLB) technology. A complete chip-to-package-to-PCB interconnect is also demonstrated by combining the quasi-coaxial transition with a chip-to-package interconnect. The quasi-coaxial signal transition has the largest impedance bandwidth among ball grid array-based quasi-coaxial signal transitions. For the modified reflector concept, a horn-shaped cavity is micromachined in the PCB substrate and remetallized with aerosol-jet printing, placing the reflector 0.25λ from the antenna. The antenna gain is improved with up to 5.3 dB. The AiP with the horn-shaped reflector is the single element with the highest gain, in eWLB technology, above 100 GHz.

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“…The SSRR had the highest gain, for a single antenna element, in eWLB packaging technology, above 100 GHz, to date. The work presented here is an extension of work first presented in [14].…”

Section: Aip In Ewlbmentioning

confidence: 87%

Section: (B)mentioning

confidence: 99%