Differential superplasticity in a multi-phase multi-principal element alloy by initial annealing

Nguyen, Nhung Thi-Cam; Asghari‐Rad, Peyman; Park, Hyojin; Kim, Hyoung Seop

doi:10.1007/s10853-022-07616-8

Cited by 13 publications

(4 citation statements)

References 72 publications

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“…It was reported that introducing a small fraction of hard phases such as B2-NiAl can dramatically restrain the occurrence of dynamic grain growth. 80) It was shown that the Ti addition to the HEA promotes the formation of Cr-rich precipitates, increases the stability of these precipitates and increases the stability of the grains up to higher temperatures than 800°C (see Fig. 7).…”

Section: Evidence Of Superplastic Flow In Heas and The Importance Of ...mentioning

confidence: 97%

Superplasticity in Severely Deformed High-Entropy Alloys

et al. 2023

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High-entropy alloys (HEAs) are a new class of material producing superior properties that have a potential for replacing many structural materials in industry. Single-phase solid solution HEAs with face-centered cubic crystal structure show significant ductility and toughness over a wide temperature range including at cryogenic temperatures. Nevertheless, the occurrence of decomposition at elevated temperatures is challenging for many applications. These materials reveal sluggish diffusion and therefore high thermal stability so that processing by severe plastic deformation gives increased kinetics of decomposition and leads to fine-multiphase microstructures which provide a potential for achieving superior superplastic elongations. The present review is designed to examine the available superplastic data for HEAs and thereby to compare the behavior of HEAs with conventional superplastic alloys.

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Section: Evidence Of Superplastic Flow In Heas and The Importance Of ...mentioning

confidence: 97%

Superplasticity in Severely Deformed High-Entropy Alloys

et al. 2023

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Section: Overview Of Nanostructured Heasmentioning

confidence: 99%

Nanostructured High Entropy Alloys as Structural and Functional Materials

Zhu,

Gao,

Yao

et al. 2024

ACS Nano

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Since their introduction in 2004, high entropy alloys (HEAs) have attracted significant attention due to their exceptional mechanical and functional properties. Advances in our understanding of atomic-scale ordering and phase formation in HEAs have facilitated the development of fabrication techniques for synthesizing nanostructured HEAs. These materials hold immense potential for applications in various fields including automobile industries, aerospace engineering, microelectronics, and clean energy, where they serve as either structural or functional materials. In this comprehensive Review, we conduct an in-depth analysis of the mechanical and functional properties of nanostructured HEAs, with a particular emphasis on the roles of different nanostructures in modulating these properties. To begin, we explore the intrinsic and extrinsic factors that influence the formation and stability of nanostructures in HEAs. Subsequently, we delve into an examination of the mechanical and electrocatalytic properties exhibited by bulk or three-dimensional (3D) nanostructured HEAs, as well as nanosized HEAs in the form of zero-dimensional (0D) nanoparticles, one-dimensional (1D) nanowires, or two-dimensional (2D) nanosheets. Finally, we present an outlook on the current research landscape, highlighting the challenges and opportunities associated with nanostructure design and the understanding of structure−property relationships in nanostructured HEAs.

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“…Due to the high entropy effect, HEAs provide better filler element mixing (Figure 13). This improves the metal-to-ceramic connections by causing the production of face-centered cubic (FCC) or body-centered cubic (BCC) structures, preventing the formation of brittle IMCs [311,312]. This section looks at HEAs' potential as a filler metal for brazing both similar and unrelated materials.…”

Section: Emerging Solder Bumps-heasmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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Differential superplasticity in a multi-phase multi-principal element alloy by initial annealing

Cited by 13 publications

References 72 publications

Superplasticity in Severely Deformed High-Entropy Alloys

Superplasticity in Severely Deformed High-Entropy Alloys

Nanostructured High Entropy Alloys as Structural and Functional Materials

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

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