Direct Electroless Plating of Iron-Boron on Copper

Blickensderfer, Jacob; Altemare, Paige; Thiel, Kay-Oliver; Schreier, H.; Akolkar, Rohan

doi:10.1149/2.0471410jes

Cited by 12 publications

(5 citation statements)

References 33 publications

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“…[31] Even non-noble metals such as Al can be deposited under extreme conditions (absence of water and air, aggressive inorganic reducer LiAlH 4 ), [58,59] but the aforementioned criteria result in electroless plating mostly being limited to the late transition metals. With standard reduction potentials between À 0.25 V and À 0.44 V, [62] Fe, [63] Co, [64,65] and especially Ni [14,18,27,66,67] can be named as the least noble but still regularly plated metals. Protocols are also available for Pd, [37,68] Pt [13,69] and the coinage metals Cu, [70,71] Ag [35,[51][52][53][54][55][56] and Au.…”

Section: Metal Complexmentioning

confidence: 99%

Electroless Plating of Metal Nanomaterials

Muench

2021

ChemElectroChem

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Electroless plating is commonly associated with metallizing macroscopic work pieces, but also represents a surprisingly powerful nanomanufacturing tool. This review details the technique's use for creating nanomaterials of arbitrary dimensionality, ranging from nanoparticles over nanotubes, nanowires, and ultrathin films to nanostructured lattices, focusing on the solution chemistry and mechanistic aspects. The synthesis of defined nanostructures serves as overarching perspective, which is enriched by drawing connections to and insights from related fields. Strategies for controlling the size, shape, crystallinity, porosity, composition, and arrangement of electrolessly plated nanostructures are outlined, including templating (which harnesses the method's exceptional conformality to guide and limit deposit formation), the complementary approach of selective growth, tailored seeding, and bath design. Being able to strike convincing compromises between material quality and ease of preparation, electroless nanoplating has a distinct potential to facilitate the application of metal nanomaterials.

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Section: Metal Complexmentioning

confidence: 99%

Electroless Plating of Metal Nanomaterials

Muench

2021

ChemElectroChem

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“…Galvanic coupling can be avoided in some cases by simple substrate surface treatment or alteration of the EL bath composition. Akolkar and co-workers 257 successfully plated EL Fe onto a Cu substrate at pH 10−13 by increasing the [BH 4 − ] in an Fe II -Rochelle salt bath to prepare hard, corrosion resistant, solderable coatings. Rohan et al 258 added Ni II salts to an EL Fe bath formulated at pH 6.5 with citric acid and CH 3 CH(OH)COOH ligands and the strong reductant, DMAB, to deposit EL permalloy (i.e., NiFe alloy) films having oriented magnetic dipoles onto a Cu-coated Si substrate at temperatures exceeding 58 °C in the presence of a magnetic field.…”

Section: ■ Elementsmentioning

confidence: 99%

“…Galvanic coupling can be avoided in some cases by simple substrate surface treatment or alteration of the EL bath composition. Akolkar and co-workers successfully plated EL Fe onto a Cu substrate at pH 10–13 by increasing the [BH 4 – ] in an Fe II -Rochelle salt bath to prepare hard, corrosion resistant, solderable coatings. Rohan et al .…”

Section: Elementsmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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“…However, the existence of salt and dissolved oxygen in seawater enhances the electrochemical corrosion of copper. To prevent the accident occurring, researchers used many methods, such as corrosion inhibitors (Forslund et al , 2013; Hosseinpour et al , 2013; Liu et al , 2015), self-assembly membrane technology (Liu et al , 2018), coatings (Parker and Holt, 2014) and surface passivation (Blickensderfer et al , 2014). Self-assembly membrane technology can form ordered molecular membrane on copper surface, and then metal substrates can be effectively protected.…”

Section: Introductionmentioning

confidence: 99%

Corrosion inhibition behavior of four benzimidazole derivatives and benzotriazole on copper surface

Liu

Lü

et al. 2020

ACMM

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Purpose This paper aims to reduce environment pollution caused by benzotriazole. The authors chose one of the best inhibitors from 2-aminobenzimidazole, 2-methylbenzimidazol, 2-mercaptobenzimidazole and benzimidazole in combination with benzotriazole. Design/methodology/approach The electrochemical measurement indicated that 2-methylbenzimidazol had the best inhibition behavior. Then, it was mixed with benzotriazole. Techniques such as field emission scanning electron microscopy, atomic force microscopy, Raman spectroscopy and optical contact angle measurements were used. Findings The results showed that the inhibition efficiency was up to 99.98%, when the mixture concentration was 20 mmol/L and the molar ratio 1:1. Originality/value 1-benzotriazole was mixed with 2-methylbenzimidazol for the first time. During the exist of methyl, 2-methylbenzimidazol has the better inhibition; this point was ignored by researchers. GRAPHICAL ABSTRACT

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Direct Electroless Plating of Iron-Boron on Copper

Cited by 12 publications

References 33 publications

Electroless Plating of Metal Nanomaterials

Electroless Plating of Metal Nanomaterials

Electroless Metallization of the Elements: Survey and Progress

Corrosion inhibition behavior of four benzimidazole derivatives and benzotriazole on copper surface

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