Double-Beam Cantilever Probe for Crack Probability Analysis of Multilayer Substrates During Wafer Probing

Tremmel, F.; Nagler, O.; Kutter, C.; Holmer, R.

doi:10.1109/jsen.2024.3486355

IEEE Sensors J.

2024

DOI: 10.1109/jsen.2024.3486355

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Double-Beam Cantilever Probe for Crack Probability Analysis of Multilayer Substrates During Wafer Probing

F. Tremmel,

O. Nagler,

C. Kutter

et al.

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Double-Beam Cantilever Probe for Crack Probability Analysis of Multilayer Substrates During Wafer Probing

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