2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016
DOI: 10.1109/itherm.2016.7517590
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Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys

Seetharaman Sridhar
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Anto Raj
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et al.
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Cited by 9 publications
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Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications

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Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications

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1
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Akkara
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Dynamics of the corrosion for SAC305 solder alloy in salt environment

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Effect of Solder Sphere Alloys and Surface Finishes on the Reliability of Lead-Free Solder Joints in Accelerated Thermal Cycling

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2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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