Dual-functional linear and star POSS-containing organic–inorganic hybrid block copolymers: synthesis, self-assembly, and film property

Ma, Yanli; Wu, Hailiang; Shen, Yanqin

doi:10.1007/s10853-022-07071-5

Cited by 4 publications

(3 citation statements)

References 27 publications

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“…They found that the adhesive strength increased with the number of arms of the BCPs, from 237 N for linear monobrachial BCPs to 431 N for star six-arm BCPs. They attributed this improvement to two factors: (1) the lower viscosity of the BCP solution with more arms, which enhanced its wetting and diffusion ability on glass surfaces; and (2) the higher density of branches of the BCPs with more arms, which increased their intermolecular forces and cohesion [ 79 ].…”

Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%

Organosilicon Compounds in Hot-Melt Adhesive Technologies

Czakaj,

Sztorch,

Romanczuk-Ruszuk

et al. 2023

Polymers

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Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol–gel condensation products or their mechanism of action on the adherent surface can be considered of sol–gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018–2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives.

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Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%

Organosilicon Compounds in Hot-Melt Adhesive Technologies

Czakaj,

Sztorch,

Romanczuk-Ruszuk

et al. 2023

Polymers

View full text Add to dashboard Cite

show abstract

“…126 Several other organic-inorganic BCPs based on POSS cages have been studied during the last decade. [127][128][129][130][131] Pyun and Matyjaszewski prepared PMAPOSS from n-butyl acrylate monomers to form methacryloyl POSS BCPs. 132 133 We extended these BCPs with various volume fractions of each segment and then blended them with phenolic resin (Fig.…”

Section: Self-assembly Of Chain-end-tethered Mono-functionalized Poss...mentioning

confidence: 99%

“…Several other organic–inorganic BCPs based on POSS cages have been studied during the last decade. 127–131 Pyun and Matyjaszewski prepared PMAPOSS from n -butyl acrylate monomers to form methacryloyl POSS BCPs. 132 Hayakawa et al used sequential anionic living polymerization to synthesize PMMA- b -PMAPOSS and PS- b -PMAPOSS [Fig.…”

Section: Introductionmentioning

confidence: 99%