2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159626
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Duplicable and effective — A new drop test for BGA assemblies

Dongji Xie
1
,
Andy Zhang
2
,
Hossein Shirangi
3
et al.
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Cited by 3 publications
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Effect of PCB and Package Type on Board Level Vibration Using Vibrational Spectrum Analysis

Jalink
1
,
Roucou
2
,
Zaal
3
et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
9
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Effect of PCB and Package Type on Board Level Vibration Using Vibrational Spectrum Analysis

Jalink
1
,
Roucou
2
,
Zaal
3
et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
9
0
0
0
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Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test Method

Thukral
1
,
Zaal
2
,
Roucou
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
8
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Considerations on a Smart Strategy for Simultaneously Testing Multiple PCB Assemblies in Board Level Vibration

Thukral
1
,
Roucou
2
,
Sauze
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
3
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