JAE
 2019
DOI: 10.3233/jae-180021
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Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing

Shiwei Yan
1
,
Yu Lei
2
,
Sheng Huang
3
et al.
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Cited by 4 publications
(1 citation statement)
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“…Ag-Cu-Sn mixed powders for brazing were obtained with a density higher than 90% by Yan et al (2019). Hence, solder preforms fabricated by EMC can be used for large area IGBT chip attachments directly.…”
Section: Introductionmentioning
confidence: 99%

Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics

Tuo
1
,
Yu
2
,
Liu
3
et al. 2021
Journal of Materials Processing Technology
14
0
5
0
View full textAdd to dashboardCite
“…Ag-Cu-Sn mixed powders for brazing were obtained with a density higher than 90% by Yan et al (2019). Hence, solder preforms fabricated by EMC can be used for large area IGBT chip attachments directly.…”
Section: Introductionmentioning
confidence: 99%

Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics

Tuo
1
,
Yu
2
,
Liu
3
et al. 2021
Journal of Materials Processing Technology
14
0
5
0
View full textAdd to dashboardCite

Numerical simulation of magnetic pulse radial compaction of W-Cu20 powder with a field shaper

Li
1
,
Xia
2
,
Zhao
3
et al. 2021
Int J Adv Manuf Technol
8
0
3
0
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Non-coupled Finite Element Modelling of Electromagnetic Radial Compaction of Pure Aluminium Powder

Thirupathi
1
,
Kumar2,
Kore
3
2023
Int. J. Precis. Eng. Manuf.
5
0
0
0
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