Dynamic Electrolyte Spreading during Meniscus-Confined Electrodeposition and Electrodissolution of Copper for Surface Patterning

Abstract

Meniscus-confined electrodeposition and electrodissolution are a facile maskless approach to generate controlled surface patterns and 3D microstructures. In these processes, the solid–liquid interfacial area confined by the meniscus dictates the zone on which the electrodeposition or the electrodissolution occurs. In this work, we show that the process of electrodeposition or electrodissolution in a meniscus-confined droplet system can lead to dynamic spreading of the meniscus, thereby changing the solid–liquid interfacial area confined by the meniscus. Our results show that the wetting dynamics depends on the applied voltage and the type of interface underneath the droplet, specifically a smooth surface with a homogeneous solid–liquid interface or a superhydrophobic surface with a heterogeneous solid–liquid and liquid–vapor interface. It is found that both electrodissolution and electrodeposition processes induced droplet spreading in the case of a smooth surface with a homogeneous interface. However, a superhydrophobic surface with a heterogeneous interface under the droplet produced nonlinear spreading during electrodissolution and spreading inhibition during electrodeposition. The underlying mechanisms resulting in the observed behavior have been explicated. The dynamic droplet spreading could modify the dimensions of the patterns formed and hence is of immense importance to the meniscus-confined electrochemical micromachining. The findings also provide fundamental insights into the spreading behavior and wetting transitions induced by electrochemical reactions.