Dynamic WIP Management with the BullWIP Situation for Semiconductor Fabrication Foundry

Abstract

Complementary Metal Oxide Semiconductor(CMOS) is a complex and very delicate process in semiconductor. In typical 30,000 wafer capacity of single foundry business model, the CMOS product loads are mixed from various technologies to serve wider market segments. Total devices can be ranged from 100 to 200. This approach creates variables for process time, equipment usage, number of processing steps which leads to inconsistent WIP profiling at respective time period. Approach to maximize the output is used by changing the methodology of WIP movement through a good WIP Profile chart management. A dynamic WIP management approached can improve the FAB out ~ 5%. It will also help the factory to make a right decision to manage the WIP balancing especially when we face BullWIP situation. The Production Control will get a good benefit from this study. A linear plan is no longer work in managing BullWIP situation and an approach on how to improve the line balancing is required.