Effect of initial grain size on dynamic recrystallization of copper

Błaż, L.; Sakai, Tetsuo; Jonas, J. J.

doi:10.1179/030634583790420448

Cited by 159 publications

(100 citation statements)

References 11 publications

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“…Andrade et al 37) observed dynamically recrystallized grains as small as 100 nm in Cu at a strain rate of 10 4 s À1 and a total shear strain of $ 8. Even though their grain size is one order of magnitude smaller than the grain size reported in literature, [38][39][40][41][42][43] the result seems to be consistent with the trend extrapolated from the empirical equation of Blaz et al, 44) Fig. 14,…”

Section: Evolution Towards Nanostructures Upon Prolongedsupporting

confidence: 78%

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Wang

Jiao

2003

Mater. Trans.

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The dynamic grain refinement behavior upon severe plastic deformation has been systematically studied in commercial purity copper that was heavily cold rolled to large deformations at cryogenic temperatures. The low-temperature rolling allows the accumulation of extraordinarily high densities of dislocations in Cu, enabling an investigation of the various dynamic recrystallization phenomena upon further deformation. The eventual steady-state grain sizes achieved, as well as the dynamic recrystallization mechanisms, are studied using controlled deformation tests combined with transmission electron microscopy. The dominant mechanisms observed to contribute to grain refinement in Cu include the classical migration dynamic recrystallization process, the deformation twinning, as well as the continuous dynamic recrystallization via progressive lattice rotation upon deformation to extremely large strains. The strain rate and deformation temperature have strong effects on the operative mechanisms and the grain sizes achieved in the ultrafine and nanocrystalline regimes.

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Section: Evolution Towards Nanostructures Upon Prolongedsupporting

confidence: 78%

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Wang

Jiao

2003

Mater. Trans.

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“…As the initial grain size is reduced, flow stress oscillations appear while an increased initial grain size stabilizes the flow stress behavior. The simulations replicate the experimentally obtained behavior as presented by [46], cf. Fig.…”

Section: Cellular Automaton Formulationsupporting

confidence: 71%

“…As shown in Fig. 5, the final grain size at some of the [46]. considered temperatures deviates slightly from the experimental values.…”

Section: Cellular Automaton Formulationmentioning

confidence: 83%

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Simulation of discontinuous dynamic recrystallization in pure Cu using a probabilistic cellular automaton

Hallberg

Wallin

Ristinmaa

2010

Computational Materials Science

113

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A cellular automaton algorithm with probabilistic cell switches is employed in the simulation of dynamic discontinuous recrystallization. Recrystallization kinetics are formulated on a microlevel where, once nucleated, new grains grow under the driving pressure available from the competing processes of stored energy minimization and boundary energy reduction. Simulations of the microstructural changes in pure Cu under hot compression are performed where the influence of different thermal conditions are studied. The model is shown to capture both the microstructural evolution in terms of grain size and grain shape changes and also the macroscopic flow stress behavior of the material. The latter gives the expected transition from single-to multiple-peak serrated flow with increasing temperature. Further, the effects on macroscopic flow stress by varying the initial grain size is analyzed and the model is found to replicate the shift towards more serrated flow as the initial grain size is reduced. Conversely, the flow stress is stabilized by larger initial grain sizes. The extent of recrystallization as obtained from simulations are compared to classical JMAK theory and proper agreement with theory is established. In addition, by tracing the strain state during the simulations, a post-processing step is devised to obtain the macroscopic deformation of the cellular automaton domain, giving the expected deformation of the equiaxed recrystallized grains due to the macroscopic compression.

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“…Nevertheless, the initially rapid grain refinement has shown a decrease in the refinement rate. In our future work, the replacement of FFT-EVP with a finite-strain framework will eventually allow us to approach the steady grain size revealed by many DRX experiments (Sah et al, 1974;Blaz et al, 1983;Sakai and Jonas, 1984).…”

Section: Kinetics Of Drxmentioning

confidence: 99%

An integrated full-field model of concurrent plastic deformation and microstructure evolution: Application to 3D simulation of dynamic recrystallization in polycrystalline copper

Zhao

Low

Wang

et al. 2016

International Journal of Plasticity

106

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Many time-dependent deformation processes at elevated temperatures produce significant concurrent microstructure changes that can alter the mechanical properties in a profound manner. Such microstructure evolution is usually absent in mesoscale deformation models and simulations. Here we present an integrated full-field modeling scheme that couples the mechanical response with the underlying microstructure evolution. As a first demonstration, we integrate a fast Fourier transform-based elasto-viscoplastic (FFT-EVP) model with a phase-field (PF) recrystallization model, and carry out three-dimensional simulations of dynamic recrystallization (DRX) in polycrystalline copper. A physics-based coupling between FFT-EVP and PF is achieved by (1) adopting a dislocation-based constitutive model in FFT-EVP, which allows the predicted dislocation density distribution to be converted to a stored energy distribution and passed to PF, and (2) implementing a stochastic nucleation model for DRX. Calibrated with the experimental DRX stress-strain curves, the integrated model is able to deliver full-field mechanical and microstructural information, from which quantitative description and analysis of DRX can be achieved. It is suggested that the initiation of DRX occurs significantly earlier than previous predictions, due to heterogeneous deformation. DRX grains are revealed to form at both grain boundaries and junctions (e.g., quadruple junctions) and tend to grow in a wedge-like fashion to maintain a triple line (not necessarily in equilibrium) with old grains. The resulting stress redistribution due to strain compatibility is found to have a profound influence on the subsequent dislocation evolution and softening.

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Effect of initial grain size on dynamic recrystallization of copper

Cited by 159 publications

References 11 publications

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Simulation of discontinuous dynamic recrystallization in pure Cu using a probabilistic cellular automaton

An integrated full-field model of concurrent plastic deformation and microstructure evolution: Application to 3D simulation of dynamic recrystallization in polycrystalline copper

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