Effect of intermediate rolling on the microstructure and Je performance of Ag-sheathed Bi-2223 tapes

Han, Yi; Liu, L.; Song, Xiaozhen; Kang, Whang-Jin; Zhang, J.S.; Liu, Q.; Han, Zhiqiang; Zheng, Keqing

doi:10.1016/j.physc.2004.12.009

Cited by 1 publication

(1 citation statement)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since the Bi2223 material is a brittle ceramic, the metal sheathing is needed to impart mechanical, electrical and cryogenic stability to the superconductor [1]- [14]. In applications, tapes sheathed with Ag-alloy have an added advantage because of their better strength compared to pure Ag [8]- [10]. Pure Ag is too soft compared to the BSCCO superconductor core.…”

Section: Microstructure Observations Of Ag Andmentioning

confidence: 99%

Microstructure Observations of Ag and Ag-Alloy Sheathed Bi2223 Tapes

Liu

Zeng

2007

IEEE Trans. Appl. Supercond.

View full text Add to dashboard Cite

Abstract-37 filament Bi2223 tapes with different configurations of Ag, AgAu7wt% AgSb0.6wt% and AgMg0.2wt% as the precursor and restack sheaths were fabricated using commercial Bi2223 precursor material and powder-in-tube techniques. Short length samples were heat treated at a temperature in the range of 832 C to 846 C for the first stage (HT 1), followed by a second stage (HT 2) at 825 C for 40 h and slow cooled to 785 C. An intermediate roll pass was performed between the heat treatment stages. The critical current (I c ) of the tapes was measured at 77 K in self-field and in fields up to 1 T. The microstructure of the alloy sheaths was examined using optical microscopy, and the Bi2223 filaments after HT 1 and HT 2 were examined using scanning electron microscopy (SEM). It was observed that the sequence of hardness, tensile strength, and critical bend strains from higher to lower levels is very much related to the grain sizes in the restack sheath. J c of the tapes in zero field and in applied field was influenced by the phase composition, core density, grain connectivity, grain alignment and the interface between the Bi2223 filament and sheath.

show abstract

Section: Microstructure Observations Of Ag Andmentioning

confidence: 99%