2020 Joint International Conference on Digital Arts, Media and Technology With ECTI Northern Section Conference on Electrical, 2020
DOI: 10.1109/ectidamtncon48261.2020.9090724
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Effect of Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

Anan Sukantharat
1
,
Kessararat Ugsornrat
2
,
Chalermsak Sumithpibul
3
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