Effect of Package Singulation Parameters on Dual Flat Non-leaded Package Delamination

Wu, Siying; Tan, Shwu Miin; Xue, Jianlu; Ng, Cheong Huat; Li, Zhigang

doi:10.1109/impact56280.2022.9966629

2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2022

DOI: 10.1109/impact56280.2022.9966629

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Effect of Package Singulation Parameters on Dual Flat Non-leaded Package Delamination

Siying Wu¹,

Shwu Miin Tan²,

Jianlu Xue³

et al.

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Effect of Package Singulation Parameters on Dual Flat Non-leaded Package Delamination

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References 6 publications

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