Effect of Solvent Mixture on the Properties of LTCC Slurry and Green Sheets

Cho, Beom-Joon; Park, Eun–Tae

doi:10.3740/mrsk.2006.16.9.533

Cited by 2 publications

(2 citation statements)

References 5 publications

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“…Second problem is chemical reactivity between each material. Minimizing this reactivity, reliable bonding has to be obtained [1]. Some studies on bonding of different materials with commercial glasses in LTCC application has been reported in order to solve these problems.…”

Section: Introductionmentioning

confidence: 99%

Silicon radical effect coated on alumina powder layer in junction between different materials for LTCC

et al. 2008

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Several studies are reported on the possibility of reliable bonding alumina and barium titanate with derivation from the glass infiltration method for zero-shrinkage substrates, but infiltration into alumina was not satisfactory, compared with the case of barium titanate. In this study, silicon radical, which is main component of glass, is coated on alumina powder in order to improve glass infiltration effect in bonding alumina and barium titanate with use of common glass in low temperature cofired ceramic composite. As a result, it is verified that infiltration effect on largesized alumina powder layer was improved to the level of barium titanate which is fully glass infiltrated and bonding barium titanate and alumina was possible.

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Section: Introductionmentioning

confidence: 99%

Silicon radical effect coated on alumina powder layer in junction between different materials for LTCC

et al. 2008

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“…It is important to find a solution to these two main problems. [ 1–4 ] In this study, in order to suppress the coefficient of thermal expansion (CTE) difference among materials, different LTCC materials which have different fillers with common glass for different dielectric properties were devised as shown in Figure 1 . ‘Filler with glass’ is the most common form of LTCC materials.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ca–Al–Si–O common glass on dielectric properties of low-temperature co-fired ceramic materials with different fillers

Park¹,

Yeo

Shin

2014

Biotechnology & Biotechnological Equipment

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High-density integration in single component used for mobile communication is highly demanded with the miniaturization trend in multi-functional light-weighted mobile communication devices. Embedding passive components into multi-layered ceramic chips is also increasingly needed for high integrity. The need for high strength materials to be used in handheld devices has also increased. To this end, many attempts to join different low-temperature co-fired ceramics (LTCC) materials with different dielectric constants have been made, but failed with de-laminations or internal cracks mainly due to difference of thermal expansion coefficients. It is thought that this difference could be minimized with the use of common glass in different LTCC materials. In this study, several candidates of common glass were mixed with various fillers of LTCC to have various dielectric constants in the radio-frequency, and to minimize the mismatch in joining. Ca–Al–Si–O glass was mixed with 1.3MgO-TiO2, cordierite and CaTiO3. Mixtures were tape-cast and sintered to be compared with their micro-structures, dielectric properties and thermo-mechanical characteristics. When 1.3MgO-TiO2 with volumetric ratio of 30% was mixed with Ca–Al–Si–O glass, the measured dielectric constant was 7.9, the quality factor was 3708. With 45 volumetric percent of cordierite, the dielectric constant was 5 and the quality factor was 1052.

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Effect of Solvent Mixture on the Properties of LTCC Slurry and Green Sheets

Cited by 2 publications

References 5 publications

Silicon radical effect coated on alumina powder layer in junction between different materials for LTCC

Silicon radical effect coated on alumina powder layer in junction between different materials for LTCC

Effect of Ca–Al–Si–O common glass on dielectric properties of low-temperature co-fired ceramic materials with different fillers

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