Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn–Ag Bumps

Lee, HanMin; Lee, Seyong; Choi, Taejin; Park, SooIn; Ko, Eun Kyoung; Paik, Kyung‐Wook

doi:10.1109/tcpmt.2020.2980598

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Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn–Ag Bumps

Cited by 7 publications

References 15 publications

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Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding

Impacts of temperature gradient on microstructure and properties of Cu/Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding

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