Effect of Ti Element on the Mechanical Properties of Cu-Matrix Bonding Diamond Tool Bits

Abstract

Using the hot-pressing sintering method, Cu-matrix bonding diamond tool bits including 0, 4 and 8 % Ti content (wt.%) were prepared. The effect of Ti content on the mechanical properties of Cu-matrix bonding diamond tool bits was studied. The experimental results showed that the influence of Ti content on the flexural strengths of Cu-matrix bonding bits and diamond tool bits are significant. Furthermore, the morphologies and compositions of fracture surfaces of diamond tool bits were characterized by scanning electron microscope and energy dispersive spectroscopy. The results illustrated that when the Ti content was 4%, the interface bonding between the diamond and the Cu-matrix bonding was the strongest, the flexural strength had the maximum values of the Cu-matrix bonding bits and the diamond tool bits, the values were 644 MPa and 515.8 MPa respectively.