Abstract:Vacuum packaging is introduced as a main mode for the MEMS (Micro-electronics-Mechanical-System) devices packaging. The reliability of devices in a vacuum package has become the most important part for the successful commercialization. With the decrease in the dimension and material processing, the ubiquitous surface effect between device and substrate has become more and more effective. Surface-micromachined structures formed by the wet etching of sacrificial layers are commonly plagued by problems of stickin… Show more
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