2001
DOI: 10.1007/s11664-001-0178-9
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Effect of via etching process and postclean treatment on via electrical performance

Abstract: INTRODUCTIONReliability in integrated circuit metallization has become a subject of importance as a result of the aggressive scaling of integrated circuit dimensions. The Semiconductor Industry Association's Technology Roadmap 2 estimates that, by the year 2005, the average number of metal levels will be 8-9. Operating at 105°C, the current density for the metal line will be 1.4 mA/cm 2 and the maximum current across a via will be 0.24 mA. This will push the reliability concerns to the limit, with contacts and… Show more

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