Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions

Suh, Daewoong; Kim, Do Hun; Liu, Pilin; Kim, Hyunchul; Weninger, Jessica; Kumar, Chetan; Prasad, A.K.; Grimsley, Brian W.; Tejada, Hazel B.

doi:10.1016/j.msea.2007.01.145

Cited by 134 publications

(63 citation statements)

References 9 publications

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“…1,9 Furthermore, the drop performance of SAC 105 is known to be greater than that of SAC 305 or SAC 405. 8,16 There can be two reasons why Sn-Pb solder joints are superior to Sn-Ag-Cu solder joints in terms of resistance to impact loading. Firstly, the Sn-Pb bulk solder is more compliant than the Sn-Ag-Cu bulk solder, as displayed in Table I.…”

Section: High-speed Ball Pull Testmentioning

confidence: 99%

Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

You

Kim

Jin-A

et al. 2009

Journal of Elec Materi

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Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones and personal digital assistants (PDAs). In this study, a new test method, which is much simpler and quicker, is proposed. The method involves evaluating the elastic strain energy and relating it to the impact resistance of the solder joint by considering the YoungÕs modulus of the bulk solder and the fracture stress of the solder joint during a ball pull test at high strain rates. The results show that solder joints can be ranked in order of descending elastic strain energy as follows: Sn-37Pb, Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu, and Sn-4Ag-0.5Cu. This order is consistent with the actual drop performances of the samples.

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Section: High-speed Ball Pull Testmentioning

confidence: 99%

Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

You

Kim

Jin-A

et al. 2009

Journal of Elec Materi

View full text Add to dashboard Cite

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“…This result was linked to the reduced Ag content of the alloy, and thus the reduced formation of primary Ag 3 Sn, as well as the increased phase fraction of bSn and the relatively low elastic modulus of the b-Sn phase. [32] Suh et al discussed the effects of Ag content from a thermodynamic standpoint through the use of Fig. 2(a), where reductions in Ag are shown to alter the Sn-IMC tielines, thus increasing the phase fraction of b-Sn with decreased Ag content, in agreement with Swenson's description of such techniques.…”

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 69%

“…The SAC solder BGAs were found to have the least resistance to shear impact testing, with cracking initiating at the IMC interfacial bond layer and brittle failure of the solder joints. The The drop impact testing results of the study, where the superior performance of the SAC105 (Sn-1.0Ag-0.5Cu wt.%) alloy over the SAC405 (Sn-4.0Ag-0.5Cu wt.%) alloy can be seen [32] (Color figure available online) addition of Ni to the SC alloy was found to ''smooth'' the morphology of the interfacial Cu 6 Sn 5 layer between the solder BGA and the bonded pad. [33] These results agreed well with research that has been conducted in the area of Ni-doped Cu- 6 Sn 5 by a number of different research groups.…”

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 87%

“…Suh et al studied the effects of reduced Ag content on the fracture resistance of SAC solders, where SAC105 (Sn-1.0Ag-0.5Cu wt.%) and SAC405 (Sn-4.0Ag-0.5Cu wt.%) were compared via drop impact testing. [32] The results of the study found that the SAC105 alloy displayed superior drop impact resistance due to the increased bulk compliance and high plastic energy dissipation of the alloy microstructure. This result was linked to the reduced Ag content of the alloy, and thus the reduced formation of primary Ag 3 Sn, as well as the increased phase fraction of bSn and the relatively low elastic modulus of the b-Sn phase.…”

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 93%

“…A greater than 10x enhancement of the number of drops to joint failure was realized for SAC105 as compared to SAC405. [32] In addition to the reduction of Ag content, the reliability and mechanical performance of Sn-based solder alloys that completely eliminate Ag from the alloy design have also been examined. Tsukamoto et al performed a thorough study of Ni-doped and non-Ni-doped Sn-Cu (SC), SAC, and Sn-Pb solder ball grid array (BGA) joint systems via the use of high-speed shear impacting testing.…”

Section: Compositional Modifications To Tin-based Alloysmentioning

confidence: 99%

See 2 more Smart Citations

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Reeve

Holaday

Choquette

et al. 2016

J. Phase Equilib. Diffus.

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New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing b-Sn nucleation in Snbased solders, and isothermally solidified interconnects using transient liquid phases. Issues in bSn nucleation in Sn-based solders were summarized in the context of Swenson's 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. All of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.

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