2009
DOI: 10.1016/j.cap.2008.08.046
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Effects of different substrate materials on synthesis of Cu nanoparticles

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Cited by 5 publications
(2 citation statements)
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“…This requires a clear understanding of thin films fabrication, surface properties of the substrate as well as the chemistry and physical processes involved in the synthesis. Ghoranneviss et al [13] fabricated Cu-NP deposited on different substrates such as glass, Al 2 O 3 and SiO 2 and showed that uniform and nano-sized Cu nanoparticles can be produced on a lower-roughness substrate. Ulmeanu et al [14] have also described the self-assembly process of silica colloidal particles for substrate surfaces implying mica, glass, Ag and Au thin films.…”
Section: Introductionmentioning
confidence: 98%
“…This requires a clear understanding of thin films fabrication, surface properties of the substrate as well as the chemistry and physical processes involved in the synthesis. Ghoranneviss et al [13] fabricated Cu-NP deposited on different substrates such as glass, Al 2 O 3 and SiO 2 and showed that uniform and nano-sized Cu nanoparticles can be produced on a lower-roughness substrate. Ulmeanu et al [14] have also described the self-assembly process of silica colloidal particles for substrate surfaces implying mica, glass, Ag and Au thin films.…”
Section: Introductionmentioning
confidence: 98%
“…Copper is the most significant circuit material for electronic devices and components [31,[37][38][39][40][41]. It has a great significance in all industries, particularly in the electrical sector due to low cost and high conductivity [42].…”
Section: Reduction and Sintering Of Copper Nano-particlesmentioning
confidence: 99%