Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Liu, Shaoyi; Yao, Songjie; Xue, Song; Wang, Benben; Jin, Hui; Pan, Chenghui; Zhang, Yinwei; Zhou, Yijiang; Zhou, Rui; Li-hao, Ping; Min, Zhixian; Zhang, Daxing; Wang, Congsi

doi:10.1108/mi-10-2022-0183

Cited by 3 publications

(2 citation statements)

References 24 publications

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“…The FEA response is equivalent plastic strain at the SMT solder danger point, but the response of the forward prediction model is TC life, which is calculated by Engelmaier low-cycle fatigue model. Details of FEA, such as boundary conditions and loads, and TC life calculation methods based on Engelmaier low cycle fatigue model can be referred to in our previous work (Liu et al , 2023). The MSALE-based ensemble model converges after 167 adaptive updates.…”

Section: Multisurrogate Accumulative Local Error-based Ensemble Forwa...mentioning

confidence: 99%

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Liu

Xue

Lian

et al. 2023

SSMT

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Purpose The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures. Design/methodology/approach The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure. Findings Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance. Originality/value Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.

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Section: Multisurrogate Accumulative Local Error-based Ensemble Forwa...mentioning

confidence: 99%

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Liu

Xue

Lian

et al. 2023

SSMT

Self Cite

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“…Surface mount technology (SMT) is a technology to assemble electronic components up to a wide range of complex electronic devices (Franke et al , 2021; Liu et al , 2023; Xu et al , 2020). In SMT, there are three primary activities of a surface mount assembly line mainly stencil printing process, pick and place and solder reflow (Tsai, 2008).…”

Section: Introductionmentioning

confidence: 99%

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

Mohamed Sunar,

Abu Bakar,

et al. 2023

SSMT

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Purpose This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing. Design/methodology/approach The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing. Findings The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%. Originality/value Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

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STFE-YOLOX: A Small Target Recognition Network for Surface Mount Component Detection

Li,

Wang,

2024

2024 36th Chinese Control and Decision Conference (CCDC)

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Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Cited by 3 publications

References 24 publications

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

STFE-YOLOX: A Small Target Recognition Network for Surface Mount Component Detection

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