Effects of Oxidizer in Metal CMP Slurry on Open Circuit Potential Change during Metal Polishing

Shima, Shohei; Kamioka, Shintaro; Yasuda, Shingo; Nagano, Hidekazu; Wada, Yutaka; Tokushige, Katsuhiko; Fukunaga, Atsushi; Tsujimura, Manabu

doi:10.7567/ssdm.2006.g-7-4

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 2006

DOI: 10.7567/ssdm.2006.g-7-4

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Effects of Oxidizer in Metal CMP Slurry on Open Circuit Potential Change during Metal Polishing

Shohei Shima¹,

Shintaro Kamioka²,

Shingo Yasuda³

et al.

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Effects of Oxidizer in Metal CMP Slurry on Open Circuit Potential Change during Metal Polishing

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