Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials. Findings X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa. Originality/value The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.

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“…Similar research was realised also in tests (Cheng et al , 2015). Soldering in the air, without ultrasound activation, was used in that case.…”

Section: Introductionsupporting

confidence: 74%

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Koleňák

Kostolný

Drápala³

et al. 2019

SSMT

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“…It is applied without flux or preliminary coating of the substrates, and it does not contain lead or cadmium, thus conforming to requirements of all initiatives regarding lead-free soldering (RoHS, etc.). The solderability of metallic or ceramic materials by Sn-Ag-Ti-based solders is relatively well documented in the literature [20][21][22][23][24][25][26]. The authors of these publications have proved the suitability of the base for soldering of ZnS-SiO 2 , ITO, Al 2 O 3 , MAO-coated Al alloy, TiO 2 , graphite, and AlN.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

et al. 2021

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The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable ε-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.

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“…The effect of ultrasound on bond formation between the solder alloyed with Ti and a semiconductor or ceramic substrate is documented in several professional publications [25][26][27][28][29].…”

Section: Introductionmentioning

confidence: 99%

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Koleňák

Kostolný

Drápala

et al. 2021

Metals

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The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

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Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

Cited by 19 publications

References 22 publications

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

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