Efficient modeling of metallic interconnects for thermo-mechanical simulation of SOFC stacks: Homogenized behaviors and effect of contact

Molla, Tesfaye Tadesse; Kwok, Kawai; Frandsen, Henrik Lund

doi:10.1016/j.ijhydene.2016.03.002

Cited by 24 publications

(32 citation statements)

References 29 publications

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“…There are various types of planar SOC stack designs used by different developers of the SOC technology . Some designs involve contact layers between the interconnects and cells , whereas others rely on profiled interconnects or both to facilitate the flow of gases within the stack , , . Some developers use metallic interconnects, where the channels are machined or etched from a larger piece , while others prefer shaped metal foil interconnects (e.g., using hydro‐forming or mechanical pressing) , .…”

Section: Introductionmentioning

confidence: 99%

“…Some designs involve contact layers between the interconnects and cells , whereas others rely on profiled interconnects or both to facilitate the flow of gases within the stack , , . Some developers use metallic interconnects, where the channels are machined or etched from a larger piece , while others prefer shaped metal foil interconnects (e.g., using hydro‐forming or mechanical pressing) , . Besides, there is also recent development of monolithic stacks, which also utilize thin ceramic interconnects .…”

Section: Introductionmentioning

confidence: 99%

“…However, during operation of SOCs, the SOC stack experiences local heating (i.e., due to the electro‐chemical reactions and ohmic heating) that can generate thermo‐mechanical stresses . These stresses could cause permanent deformations of the metallic interconnect, which may lead to electrical contact loss at the interface with the electrode , , . The metallic interconnect is one of the dominant structural component in planar SOCs, and thus its deformational behavior significantly affects the distribution of stresses throughout the SOC stack .…”

Section: Introductionmentioning

confidence: 99%

“…The investigation is performed by numerical modeling of the SRU using a commercial finite element (FE) software ABAQUS[trade]. To achieve the long‐term simulations, the SRU models relies on so‐called homogenized representation of the interconnect structure , .…”

Section: Introductionmentioning

confidence: 99%

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Modeling the Mechanical Integrity of Generic Solid Oxide Cell Stack Designs Exposed to Long‐term Operation

2018

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Thermal cycling and creep in metallic interconnects during operation of solid oxide cell (SOC) stacks could cause contact losses in the interface between the interconnect and cells. The magnitude of stress and its distribution within the SOC stack depends on the overall design of the stack and the operating conditions. In this study, stresses in different types of generic SOC stack designs caused by external loading and temperature variations through long‐term operation are investigated. The investigation includes stack designs with and without contact components combined with machined (cross‐shaped) or pressed (corrugated) interconnects. Two different generic temperature profiles in the stacks are considered. Special focus is given to stresses that can cause possible delamination of the interconnect from the cell that subsequently leads to loss of electrical contact. It is found that too rigid designs cause high stresses and creep in the interconnects, and so‐called stress reversal will cause delamination between interconnect and cell during shut‐down. Furthermore, the study also presents the effect of SOC stack design and/or thermal gradient on the magnitude of in‐plane stresses in the cells. Here it is found that it advantageous to cool the stack primarily with convection, as this causes a linear thermal profile and much lower stresses than if cooling is relying on conduction in the solids, as this causes a thermal gradient in several directions.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Modeling the Mechanical Integrity of Generic Solid Oxide Cell Stack Designs Exposed to Long‐term Operation

2018

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“…The bonding between solid oxide fuel cell (SOFC) electrodes and metal interconnects is of utmost importance since it may determine overall stack lifetime [1][2][3][4]. Fig.…”

Section: Introductionmentioning

confidence: 99%

Determination of the bonding strength in solid oxide fuel cells’ interfaces by Schwickerath crack initiation test

Boccaccini

Ševeček

Frandsen

et al. 2017

Journal of the European Ceramic Society

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High Temperature Solid Oxide Electrolysis – Technology and Modeling

Mueller,

Klinsmann,

Sauter

et al. 2023

Chemie Ingenieur Technik

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In the global quest to renounce from fossil fuels, a large demand for the renewable production of hydrogen via water electrolysis exists. In this context, the solid oxide electrolyzer (SOE) is an interesting technology due to its high efficiency resulting from elevated operating temperatures of up to 900 °C. Physical modeling plays a vital role in the development of SOEs, as it lowers experimental costs and provides insight where measurements reach limits. A main challenge for modeling SOEs is the multitude of physical effects, occurring and interacting on various spatial and temporal scales. This requires assumptions and simplifications, particularly when increasing scope and dimensions of a model. In this review, we discuss the different approaches currently available in literature.

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Efficient modeling of metallic interconnects for thermo-mechanical simulation of SOFC stacks: Homogenized behaviors and effect of contact

Cited by 24 publications

References 29 publications

Modeling the Mechanical Integrity of Generic Solid Oxide Cell Stack Designs Exposed to Long‐term Operation

Modeling the Mechanical Integrity of Generic Solid Oxide Cell Stack Designs Exposed to Long‐term Operation

Determination of the bonding strength in solid oxide fuel cells’ interfaces by Schwickerath crack initiation test

High Temperature Solid Oxide Electrolysis – Technology and Modeling

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