Electrical analysis and solder joint quality of PCB land-pad design for QFP E-pad package

Cheng, Kuan-I; Liu, Yi-Cheng; Liu, Pai-Chou; Wu, Sung‐Mao

doi:10.23919/icep.2017.7939446

2017 International Conference on Electronics Packaging (ICEP) 2017

DOI: 10.23919/icep.2017.7939446

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Electrical analysis and solder joint quality of PCB land-pad design for QFP E-pad package

Kuan-I Cheng

Yi-Cheng Liu

Pai-Chou Liu

et al.

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Electrical analysis and solder joint quality of PCB land-pad design for QFP E-pad package

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References 11 publications

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