2014
DOI: 10.4071/2014dpc-ta23
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Electrical Performance Comparison between fcBGA and eWLB Packages

Abstract: Wafer-level packages, such as embedded-Wafer-Level-Ball-Grid-Array (eWLB) packages, can provide smaller form-factors and thinner profiles, as finer design rules on W/S, and thinner layers (both metal layers and passivation layers) can be applied in such packages. However, a routine conversion from fcBGA to eWLB does not guarantee the electrical performance will be the same. Designer's electrical skills still play important roles to reduce design cycle-time for meeting critical electrical perform… Show more

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