Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations

Novel Flip-Chip Probing Methodology Using Electron Beam Probing

“…It is now possible to perform EBP from the (c) backside on exposed active transistor areas [4,7]. Recent investigations have shown that removing the bulk silicon and Image of the inverter chain, with FIB opened areas influence on circuit performance [5].…”