Electrically bistable nonvolatile switching devices fabricated with a high performance polyimide bearing diphenylcarbamyl moieties

Hahm, Suk Gyu; Choi, Seungchel; Hong, Sang Hyun; Lee, Taek Joon; Park, Samdae; Kim, Dong-Min; Kim, Jin Chul; Kwon, Wonsang; Kim, Kyung‐Tae; Kim, Mee Jung; Kim, Ohyun; Ree, Moonhor

doi:10.1039/b814470m

Cited by 63 publications

(28 citation statements)

References 35 publications

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“…The polyimide (Figure 2, (3), M n = 746 g/mol, M w = 2,350 g/mol, PDI = 3.15, measured by GPC, PS standard) was prepared by condensation polymerization of 2,2′-bis-(3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 3,3′-hydroxy-4,4′-diaminobiphenyl according to the procedure of Hahm et al (Hahm et al 2009). The triazene polymer, prepared by interfacial polycondensation from the bis-diazonium salt of bis(4-aminophenyl) ether and 1,6-bis(methylamino)-hexane, (Figure 2, (4)) was synthesized according to a procedure described previously (Stebani et al 1993; Nagel et al 2007).…”

Section: Methodsmentioning

confidence: 99%

A study of photothermal laser ablation of various polymers on microsecond time scales

Kappes

Schönfeld

et al. 2014

SpringerPlus

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To analyze the photothermal ablation of polymers, we designed a temperature measurement setup based on spectral pyrometry. The setup allows to acquire 2D temperature distributions with 1 μm size and 1 μs time resolution and therefore the determination of the center temperature of a laser heating process. Finite element simulations were used to verify and understand the heat conversion and heat flow in the process. With this setup, the photothermal ablation of polystyrene, poly(α-methylstyrene), a polyimide and a triazene polymer was investigated. The thermal stability, the glass transition temperature Tg and the viscosity above Tg were governing the ablation process. Thermal decomposition for the applied laser pulse of about 10 μs started at temperatures similar to the start of decomposition in thermogravimetry. Furthermore, for polystyrene and poly(α-methylstyrene), both with a Tg in the range between room and decomposition temperature, ablation already occurred at temperatures well below the decomposition temperature, only at 30–40 K above Tg. The mechanism was photomechanical, i.e. a stress due to the thermal expansion of the polymer was responsible for ablation. Low molecular weight polymers showed differences in photomechanical ablation, corresponding to their lower Tg and lower viscosity above the glass transition. However, the difference in ablated volume was only significant at higher temperatures in the temperature regime for thermal decomposition at quasi-equilibrium time scales.

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Section: Methodsmentioning

confidence: 99%

A study of photothermal laser ablation of various polymers on microsecond time scales

Kappes

Schönfeld

et al. 2014

SpringerPlus

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“…For example, P21 exhibits memory performance with a high ON/OFF current ratio of up to 10 9 , low power consumption and long retention time in both the ON and OFF states. 75 The observed rewritable memory behavior for P22 is due to Schottky emission and local filament formation. 76 For polymer P23, the filamentary mechanism has been demonstrated by in situ conductive atomic force microscopy measurements.…”

Section: Flash Propertiesmentioning

confidence: 96%

“…By changing the hole-transporting and electron-donating moieties, four PI derivatives containing diphenylcarbamyloxy (P21), 75 diphenylaminobenzylidenylimine (P22) 76 and carbazole (P23 77 and P24 78 ) on their side chains have also been synthesized for use as excellent rewritable memory devices (Scheme 9). For example, P21 exhibits memory performance with a high ON/OFF current ratio of up to 10 9 , low power consumption and long retention time in both the ON and OFF states.…”

Section: Flash Propertiesmentioning

confidence: 99%

Solution-processable triarylamine-based high-performance polymers for resistive switching memory devices

Yen

Liou

2015

Polym J

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This review summarizes the most widely used mechanisms in high-performance polymeric resistive memory devices, such as charge transfer, space charge trapping and filament conduction. In addition, recent studies of functional high-performance polymers for memory device applications are reviewed, compared and differentiated based on the mechanisms and structural design methods used. By carefully designing the polymeric structure based on these systematically investigated switching mechanisms, almost all types of current memory characteristics can be reproduced, and these memory properties show extremely high endurance during long-term operation, which makes polyimides very suitable materials for memory applications. INTRODUCTION High-performance polymersToday, life without polymers is unimaginable. Polymers have become the major synthetic materials of the 21st century. High-performance polymers (HPPs) are particularly desirable. The synthesis and development of HPPs over the past 30 years have drawn the attention of many polymer scientists and investigators. These polymers generally possess excellent physical deformation resistance and chemical deterioration resistance at high temperatures over long periods of time. The quest for HPPs began in the late 1950s to meet the demands of the military, aerospace, machine-building and electronics industries, among many other industrial applications.Hill and Walker 1 first noted that the incorporation of aromatic segments into a polymer generally results in a notable increase in its thermal stability. For this reason, much of the research work has been directed toward aromatic compositions. Hence, HPPs usually tend to contain large numbers of aromatic units in their structures. Several of these aromatic HPPs have been used for commercial applications, such as aromatic polyamides, polyimides, polyesters, polysulfones, polytriphenylamine and heterocyclic polymers (Scheme 1). Aromatic polyamides (aramids) and polyimides, such as DuPont's Kevlar fiber and Kapton film, respectively, have been well known for a long time and constantly attract more interest than other HPPs for their useful properties, such as excellent thermal and oxidative stabilities, high mechanical strengths, low flammabilities and good chemical and radiation resistances. [2][3][4][5][6][7][8][9][10][11][12][13] However, the rigidity of the backbone and strong hydrogen bonding of these HPPs result in high melting or glass-transition

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“…[11][12][13][14] To achieve electrical bistability, polyimides (PI) containing electron-donor and acceptor groups have attracted much attention, because PI not only has a conjugated structure for charge transfer but also has excellent thermal and mechanical properties. [15][16][17][18][19][20][21][22] In our previous research, PI with WORM, DRAM, and flash memory behavior have been synthesized. [23][24][25][26] We thus believe it is possible to achieve diverse PI memory materials by selecting appropriate functional groups or by adjusting the configuration of the polymer chain to generate different types of charge-transfer and different energy gaps.…”

Section: Introductionmentioning

confidence: 99%

Electrical Bistability and Erasable Memory Effect of a Functional Polyimide Film: Synthesis and Investigation of Mechanism

Tian

Jia

et al. 2015

Journal of Elec Materi

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A functional polyimide (PI) film, (hexafluoroisopropylidene)diphthalic anhydride-2-(9H-carbazol-9-yl)ethyl 3,5-diaminobenzoate (6FDA-DADBC), in which DADBC serves as electron donor and 6FDA as electron acceptor, was synthesized in this work. The PI has electrical bistability and the sandwich device ITOk6FDA-DADBC-PIkAu made by using this functional PI as the active layer has nonvolatile memory-storage properties. It can be changed between the insulating state (Off state) and the conducting state (On state) by application of potentials of approximately 0.5 V and À2.5 V, respectively, with an On/Off current ratio of approximately 10 2 , which is suitable for use as flash memory. Mechanisms of the charge transfer occurring in the materials were investigated, and are thoroughly discussed on the basis of molecular simulation. The PI has good thermal stability up to 400°C.

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Electrically bistable nonvolatile switching devices fabricated with a high performance polyimide bearing diphenylcarbamyl moieties

Cited by 63 publications

References 35 publications

A study of photothermal laser ablation of various polymers on microsecond time scales

A study of photothermal laser ablation of various polymers on microsecond time scales

Solution-processable triarylamine-based high-performance polymers for resistive switching memory devices

Electrical Bistability and Erasable Memory Effect of a Functional Polyimide Film: Synthesis and Investigation of Mechanism

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