Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)
DOI: 10.1109/eptc.1997.723928
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Electro magnetic simulation and measurement of electrical parasitics in high density QFP packages

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“…9 The RLC data can then be used to construct an equivalent circuit model of the package. There are several analytical, empirical and measurement methods to characterise an electronic package.…”
Section: Reverse Bias Microstripline Mounted Devicesmentioning
confidence: 99%
“…9 The RLC data can then be used to construct an equivalent circuit model of the package. There are several analytical, empirical and measurement methods to characterise an electronic package.…”
Section: Reverse Bias Microstripline Mounted Devicesmentioning
confidence: 99%