Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior

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Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior

Cited by 9 publications

References 17 publications

Benzyl-containing quaternary ammonium salt as a new leveler for microvia copper electroplating

Benzyl-containing quaternary ammonium salt as a new leveler for microvia copper electroplating

Decoding the suppressing effects of Pluronic triblock copolymers on copper electrodeposition

Evaluating copper plating process for filling micro vias with thin surface Cu by the 1-(4-carboxyphenyl)-5-mercapto-1H-tetrazole additive

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