Electrochemical engineering in an age of discovery and innovation

Alkire, Richard C.; Braatz, Richard D.

doi:10.1002/aic.10308

Cited by 27 publications

(16 citation statements)

References 71 publications

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“…NIST developed further insights on bump suppressions using its CEAC model [668]. And the Alkire University of Illinois group has contributed a series of improvements to the algorithms and computation methods [669][670][671][672][673].…”

Section: Part F Copper Plating In Microelectronicsmentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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Polyethylene oxides, glycols, and amines U.S.5,024,736 6/18/91 Clauss et al. Disubstituted ethane sulfonic compounds U.S.4,990,224 2/5/91 Mahmoud Urea, sodium lauryl sulfate, and tosyl or mesyl sulfonic acid U.S.4,975,159 12/4/90 Dahms Alkoxylated lactam amides U.S.4,954,226 9/4/90 Mahmoud Urea and glycerin U.S.4,948,474 8/14/90 Miljkovic Alkylarylene U.S.4,897,165 1/30/90 Bernards et al. Copper/sulfuric acid ratios U.S.4,781,801 11/1/88 Frisby Polyether surfactants þ sulfurized benzene þ grain refiner U.S.4,673,467 6/16/87 Nee Polyethers þ mercaptoimidazole þ sulfurized benzene U.S.4,555,315 11/26/85 Barbieri et al. Polyethers þ organic divalent sulfur compound þ tertiary alkyl amine with polyepichlorohydrin U.S.4,551,212 11/5/85 Rao et al. Phenazine dyestuffs U.S.4,540,473 11/22/83 Bindra et al. S-containing anions other than SO 4 U.S.4,521,282 7/11/84 Tremmel Sulfamic acid U.S.4,490,220 12/25/84 Houman Nitrogen-carbon-sulfur compound U.S.4,430,173 2/7/84 Boudot et al. Sodium salt of W-sulfo-n-propyl N,N-diethyldithiocarbamate, PEG, and crystal violet U.S.4,376,685 6/24/81 Watson Alkylated polyalkyleneimine U.S.4,347,108 8/31/82 Willis Nitrogen-and sulfur-containing compounds U.S.4,336,114 6/22/82 Mayer et al. Phthalocyanine, tertiary alkyl amine with polyepichloro hydrin, polyethyleneimine U.S.4,334,966 12/2/81 Beach et al. Polyether, mercaptoimidazole, sulfurized benzene U.S.4,310,392 1/12/82 Kohl Phenolphthalein U.S.4,272,335 2/19/80 Combs Substituted phthalocyanine radical U.S.4,242,181 12/30/80 Malak Regular coffee U.S.4,134,803 1/16/79 Eckles et al. Disulfides, sulfonic acids, and aliphatic aldehyde U.S.4,110,176 8/29/78 Creutz et al.

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Section: Part F Copper Plating In Microelectronicsmentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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“…Electromembrane processes, such as electrodialysis, electro–electrodialysis, and membrane electrolysis, have been developed considerably in industry, especially in the desalination of brackish water and chlorine–alkaline electrolysis . In the past few decades, many of these techniques used in practical applications or laboratory studies directly focus on the removal of hazardous materials in effluents or gases, the recovery and reuse of valuable constituents from wastes, closing the loops in technology and new production processes that require lower energy consumption .…”

Section: Introductionmentioning

confidence: 99%

Performance optimization of an electromembrane reactor for recycling and resource recovery of desulfurization residuals

Yang

Cao

et al. 2014

AIChE Journal

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An environmentally friendly method for electrochemically regenerating alkali-sorbent (NaOH) and recovering sulfur in the flue gas as H 2 SO 4 , while producing H 2 as a clean energy source from flue gas desulfurization (FGD) residuals in an electromembrane reactor, was proposed in this article. To optimize and improve the performance, the optimal operating conditions were deduced from the numerical simulation and validated using experimental data. Under the optimized conditions, the current efficiencies of alkali-sorbent regeneration and H 2 SO 4 reached 84 and 87%, respectively, which is comparable to those obtained in the chlor-alkali industry. Therefore, this method has the potential to be scaled up. If this technology is integrated into an existing FGD facility, the money-consuming chemical process could be transferred into a renewable resource and clean energy conversion process.

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“…Electrodeposition processes are used in the fabrication of microelectronic devices and in nanotechnology applications [1][2][3]. Copper electrodeposition with complex additive systems is used to form interconnections in microelectronic devices [4].…”

Section: Introductionmentioning

confidence: 99%